An elastic support for on-board suspension systems of a motor-vehicle includes at least one body formed of polymeric elastomeric material supplemented with carbon-based nanofillers. An outer surface is provided with one or more piezo-resistive areas where a polymeric material supplemented with carbon-based nanofillers has been made locally piezo-resistive by laser irradiation so as to define one or more electric deformation sensors configured to detect the load applied on the elastic support.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

A system including at least one inspection machine and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

The present invention relates to a method of correcting a position of a stencil mask which comprises receiving fiducial information from a screen printer, extracting position information of a pad and position information of a solder formed on a board through measuring by a solder paste inspection apparatus, estimating an x, y offset value and a rotating amount of a stencil mask based on the fiducial information by using the position information of the pad and the solder, and transmitting the x,y offset value and the rotating amount of the stencil mask to the screen printer. Thus, a reliability of solder forming process may be increased by correcting a stencil mask position by transmitting a feedback of an x,y offset value and a rotating amount of the stencil mask from a solder paste inspection apparatus, in which the x,y offset value and the rotating amount are estimated based on fiducial information transmitted from the screen printer.

A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.

Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film.