An alignment apparatus and an alignment detection method, which fall within a field of display technology, are disclosed herein. The alignment apparatus includes: a work table; a plurality of alignment rods provided on the work table, wherein a capacitor element is provided inside the alignment rod, and a capacitance of the capacitor element is changeable as the alignment rod deforms; and an alarm element connected to the capacitor element for giving an alarm when it receives a capacitance change value which exceeds a preset threshold value.

An overlay alignment detection apparatus for a display device and an exposure process system are provided by embodiments of the present disclosure, the overlay alignment detection apparatus including a bearing frame for bearing the display device, a control device, a detection device and an analysis device. The control device is configured to send control commands to the detection device depending on pre-stored coordinate information of a reference point within an overlay area of the display device when the bearing frame is at an idle time among processes; the detection device is configured to be moved to the overlay area of the display device on the bearing frame according to the control commands sent by the control device, to acquire images of the overlay area, and to send the acquired images to the analysis device; and the analysis device is configured to analyze and process an overlay alignment condition of the display device, with the images sent by the detection device. The overlay alignment detection apparatus provided by the present disclosure may determine the overlay alignment condition of the display device without measuring critical dimensions of the display device; therefore, detection efficiency may be enhanced, such that a comprehensive detection may be implemented on all display devices to be detected and product quality thereof may also be improved.

A flexible circuit board inspecting apparatus for conducting an inspection on a flexible circuit board includes a transport path and an inspection part mechanism. The transport path is configured to successively transport the flexible circuit board having a plurality of unit circuit boards arranged thereon. The inspection part mechanism is configured to bring and distance a jig for inspecting the flexible circuit board transported on the transport path close to and from the flexible circuit board. The transport path includes a longitudinal transport portion for transporting the flexible circuit board in a downward vertical direction. The inspection part mechanism moves the jig in a direction perpendicular to the flexible circuit board transported on the longitudinal transport portion to bring and distance the jig close to and from the flexible circuit board.

A system, comprising: a conveyor to controllably move a substrate; a nozzle head controllably movable relative to the conveyor; an edge detector associated with the nozzle head to detect a leading edge of the substrate; and a control system coupled to the conveyor, nozzle head and edge detector to selectively and individually control both speed of the conveyor and position of the nozzle head relative to the conveyor in response to first and second leading edge detections to thereby position the substrate in a predetermined position for application of liquid flux by the nozzle head.

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin, and a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.

A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

A carrying structure is defined with a main area and a peripheral area adjacent to the main area, where a plurality of packaging substrates are disposed in the main area in an array manner, a plurality of positioning holes are disposed in the peripheral area, and a plurality of positioning traces are formed along a part of the edges of the plurality of positioning holes, such that the plurality of positioning traces are formed with notches.

In a device for producing and/or processing a workpiece, in particular circuit boards, in a work station, in particular for printing a corresponding blank or for checking finished circuit boards, at least one mark is provided on the workpiece. In this arrangement, at least one reference, which can be brought into alignment with the mark, is provided in the work station.