The present disclosure provides a printing system and a method for controlling a printing system. The printing system is used to print on a board, and includes at least one pair of adjustment assemblies. Each of the at least one pair of adjustment assemblies includes a carrying component, an alignment component and a drive component. The carrying component is configured to carry the board. The drive component is configured to be capable of driving the carrying component and the alignment component to move and is configured to adjust a distance between an upper surface of the carrying component and an upper surface of the alignment component to be equal to the thickness of the board. The structure of the printing system of the present disclosure enables a height difference between the upper surface of the alignment component and the upper surface of the carrying component to be adjusted according to the thickness of the board to be processed, such that the height difference between the upper surface of the alignment component and the upper surface of the carrying component is equal to the thickness of the board to be processed, so as to adapt to boards of different thicknesses to be processed.

A printed circuit board comprises a substrate and an electrically conductive pattern. The pattern includes an electrode pad and a first teaching pattern that teaches a mountable range of an electronic component and includes a first line and a second line. The electronic component includes a first side surface extending in a first direction. The first line and the second line extend in the first direction. In a second direction, the first side surface is between the first line and the second line. In the first direction, the first line and the second line are each in a position different from that of the first side surface.

A carrying structure is provided and is defined with a main area and a peripheral area adjacent to the main area, where a plurality of packaging substrates are disposed in the main area in an array manner, a plurality of positioning holes are disposed in the peripheral area, and a plurality of positioning traces are formed along a part of the edges of the plurality of positioning holes, such that the plurality of positioning traces are formed with notches. Therefore, a plurality of positioning pins on the machine can be easily aligned and inserted into the plurality of positioning holes by the design of the plurality of positioning traces.

A correction mechanism includes a mounting board, a first correction assembly, and a second correction assembly. The first correction assembly includes a plurality of first limiting members and a plurality of first correction members alternating arranged with the plurality of first limiting members. The first limiting members are securely fixedly mounted on the mounting board. The first correction members are movably mounted on the mounting board and capable of moving toward the plurality of first limiting members along a first direction. The second correction assembly has a structure similar to the first correction assembly. The plurality of second limiting members and the plurality of second correction members are substantially perpendicular to and above the plurality of first limiting members and the plurality of first correction members

The present invention discloses a conductive line repairing method, which at least includes the following steps: a placing step, in which an object having at least one line breaking site is placed on a platform unit of a jet-coating module; a jetting step, in which the jet-coating module is operated to jet and coat a conductive material on the line breaking site; and a solidifying step, in which a solidifying module is operated to have the conductive material solidified, wherein the conductive material, after the solidification, makes the line breaking site conducting. In present invention, the conductive material is jetted and coated on the line breaking site of the object and then solidified to repair a circuit having the line breaking site and to resume the function of electrical conduction thereof to thereby reduce rejected products and restore production yield, achieving an effect of environmental protection.

A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, an electrical module having an upper side and a lower side, and a holding down construction. The upper side of the electrical module is arranged on the lower side of the printed circuit board. The holding down construction includes screwing posts that are configured to be screwed against the printed circuit board. The holding down construction is arranged on the upper side of the printed circuit board and includes contact structures that are at a distance from the screwing posts and configured to rest or press on the printed circuit board at specific contact points only. The printed circuit board includes dedicated support points that correspond to the specific contact points of the holding down construction and are contacted by the specific contact points. The dedicated support points are mechanically reinforced.

A component-incorporated substrate of multi-layer structure includes: a first printed wiring base having an opening; a second printed wiring base in a first side of the first printed wiring base; a third printed wiring base in a second side of the first printed wiring base; an electronic component housed in the opening of the first printed wiring base; a via penetrating one or more of the first printed wiring base, the second printed wiring base and the third printed wiring base; and an adhesive layer that fills a gap between the electronic component and the opening, a gap between the first printed wiring base and the second printed wiring base, and a gap between the first printed wiring base and the third printed wiring base.

A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.

A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.

The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).