A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.

A bending device includes a stage configured to accommodate a display panel; and a bending part adjacent to the stage and configured to accommodate a main circuit board, the bending part including a main plate reciprocating in the first direction; a first block on the main plate; a plurality of rotation supports arranged on sides of the first block, a second block between the rotation supports, coupled to the first block, and configured to reciprocate in a third direction; a third block closer to the stage than the second block is, between the rotation supports, and configured to rotate about a rotation axis parallel to a second direction; and a fourth block coupled to one side of the third block, and including a main body configured to reciprocate in the first direction and a sub-body coupled to the main body and configured to reciprocate in the third direction.

An apparatus for manufacturing catheter electrode-fPCB assemblies, the apparatus includes a tray, a heat source, and a sleeve molding station. The tray is configured to (i) receive an electrode in a designated first recess in a predefined layout of the recess, wherein the electrode is ring-shaped and (ii) receive a flexible printed circuit board (fPCB) strip in a second recess configured to enable to thread the fPCB strip via the electrode to a predefined position of the strip such that a pad patterned on the fPCB strip is aligned with the electrode. The heat source is configured to apply heat for soldering the pad to an inner surface of the electrode. The sleeve molding station is configured to mold an encapsulating sleeve over the electrode-fPCB assembly, while keeping a proximal end of the strip and at least a portion of the electrode exposed.

A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

A method for adjusting a solder paste stencil includes preloading a solder paste stencil in contact with a printed circuit board. Processing warpage is measured between the solder paste stencil and the printed circuit board to determine a dimensional offset strain due to the warpage. A stress to be applied to the stencil is determined by accessing a neural network to output the stress based on the dimensional offset strain. The stress is applied to the stencil to compensate for the warpage.