At least some embodiments of the present disclosure direct to an electrostatic sheet jamming apparatus comprising a first sheet comprising a first conductive layer, the first sheet comprising a set of first features, a first dielectric layer, and a second sheet comprising a second conductive layer and disposed proximate to the first dielectric layer, the second sheet comprising a set of second features. The first dielectric layer is disposed between the first conductive layer and the second conductive layer. The first sheet and the second sheet are non-extensible and flexible. The first sheet and the second sheet are movable relative to each other in a first state. The first sheet and the second sheet are jammed with each other in a second state when a voltage is applied between the first conductive layer and the second conductive layer.

Printed wiring board manufacturing method, and printed wiring board. The method includes preparing sheet material including cloth-like material woven of reinforced fiber with a 90 degree between warp thread and a weft thread; arranging the sheet material on a cutting-out apparatus so that the sheet material is tilted 5 to 30 degrees with respect to threads configuring the cloth-like material and cutting a portion to cross the cloth-like-material configuration threads aligned on a cutting blade at 5 to 30 degrees; cutting the sheet material from the tilted sheet material with the cut portion crossing the cloth-like-material configuration threads aligned on the cutting blade to form the sheet material with a circumferential edge of the sheet material crossing the cloth-like material configuration threads at 5 to 30 degrees; creating a mother laminate configured with the sheet material as an inner-layer board or an insulating board; and providing a conductor pattern on a metal layer of the mother laminate along a circumferential edge portion of the mother laminate.

A circuit board includes a first substrate of a fragile material, a first through-hole formed in the first substrate for allowing a screw for fixing the first substrate to a supporting body to be inserted through the first through-hole, a first step formed at an outer edge of a first region surrounding the first through-hole in the first substrate, and a second step formed along a direction from the first through-hole to the first step in the first region of the first substrate.

Locks, systems and methods of monitoring a lock, the lock having a hub with a slot rotatable by a handle to open and close a latchbolt. A locking member is moveable into and out of engagement with the hub slot to prevent and permit movement of the hub and latchbolt. A sensor on the lock, adjacent the hub and locking member, monitors a moving lock component. The sensor may sense the position of the locking member in or out of engagement with the hub slot. The sensor may be a reed switch actuated by a magnet on the moving lock component. The lock may further include a magnet mounted on the hub and the sensor may comprise a reed switch capable of being actuated by the magnet on the hub. The lock and system may include an external control unit having an alarm for controlling operation of the lock.

A fingerprint sensor, a terminal, and a method for manufacturing a fingerprint sensor are provided. The fingerprint sensor includes a chip unit and a first adhesive layer. The chip unit includes a first surface and a second surface opposite to the first surface. The first surface is configured to receive a touch operation. The first adhesive layer is directly or indirectly attached to the second surface in a peelable manner.

Various examples disclosed relate to a substrate for a semiconductor. The substrate includes a first conducting layer, having a first surface and an opposite second surface. The substrate further includes a second conducting layer extending in a direction substantially parallel to the first conducting layer. The second conducting layer includes a third surface and an opposite fourth surface. A first dielectric layer is disposed between the second surface of the first conducting layer and the third surface of the second conducting layer. The first dielectric layer includes a first dielectric material and a fiber. Slots extends between the first conducting layer and the second conducting layer. Each of the slots is defined by an internal surface of the first conducting layer, the second conducting layer, and the first dielectric layer.

A control unit (10) for an apparatus, the control unit (10) comprising: a component-carrying member (18) provided with at least one electronic component (29) configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10); and a laminate encapsulation layer (22) encapsulating at least a part of the or each electronic component (29). Optionally, the control unit comprises a second member (14) which defines a user-interaction surface (16).

A display device may include a display panel having a curved shape, a first printed circuit board and a second printed circuit board, at least one first carrier tape configured to connect the first printed circuit board to the display panel, at least one second carrier tape configured to connect the second printed circuit board to the display panel, and a connection unit configured to connect the first and second printed circuit boards to each other. A part of a layer of the connection unit may be a portion of a layer included in at least one of the first and second printed circuit boards.

An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

Locks, systems and methods of monitoring a lock, the lock having a hub with a slot rotatable by a handle to open and close a latchbolt. A locking member is moveable into and out of engagement with the hub slot to prevent and permit movement of the hub and latchbolt. A sensor on the lock, adjacent the hub and locking member, monitors a moving lock component. The sensor may sense the position of the locking member in or out of engagement with the hub slot. The sensor may be a reed switch actuated by a magnet on the moving lock component. The lock may further include a magnet mounted on the hub and the sensor may comprise a reed switch capable of being actuated by the magnet on the hub. The lock and system may include an external control unit having an alarm for controlling operation of the lock.