Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.

A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

An adhering jig includes a mounting plate having an upper surface, and a plurality of aligning parts incorporated in the mounting plate. A plurality of first holes are formed in the upper surface, and a plurality of first pins are engaged in the plurality of first holes, each having a base end and an upper end, and configured to be movable in a direction normal to the upper surface. A plurality of first adjusting members are located inward with respect to the upper surface. The plurality of first adjusting members are configured to support the plurality of first pins and to adjust movements thereof. The plurality of first adjusting members are, when the plurality of first pins are pressed in the first holes, configured to exert opposite force to the force applied through the plurality of first pins.

A load adaptive device includes a substrate, a first electrode, a second electrode, and a passive element. The substrate is configured with a first conductor and a second conductor, and the surface area of the first conductor and/or the surface area of the second conductor are at least 15 mm.sup.2. The distance between the center of the first conductor and the center of the second conductor is at least 9 mm. The first electrode, the second electrode and the passive element are disposed on the substrate. The first electrode is electrically connected to the first conductor. Two terminals of the passive element are electrically connected to the second conductor and the second electrode, respectively. In addition, a hand-made circuit module includes the load adaptive device and a hand-made loop. A part of the hand-made loop is consisted of a hand-bonded conductive tape.

Various aspects include audio devices with a capacitive sensing interface along a compound curved wall. Some aspects of the disclosure relate to wearable audio devices with a capacitive sensing interface and a flexible printed circuit board (PCB) for detecting a touch command at the interface. In certain cases, the flexible PCB has at least one slit for conforming to the compound curve of the wall. In additional implementations, the inner surface of the wall is faceted and the flexible PCB conforms to the facets in the wall.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

The present application provides a method for manufacturing a microelectrode film. The method includes: forming at least one recess on the carrier substrate by isotropic etching; forming a microelectrode seed pattern in the recess; growing a microelectrode in the recess by using the microelectrode seed pattern; making a first substrate to be in contact with a side of the carrier substrate having the recess thereon; separating the microelectrode from the carrier substrate to transfer the microelectrode onto the first substrate.

A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.