The present invention refers to a new type of transport roller providing a modified surface to provide improved transport properties for new substrates. Furthermore, it refers to horizontal transport systems beneficially utilizing such transport rollers, especially for providing retaining roller pairs. Additionally, the present invention refers to a treatment device containing such transport roller or horizontal transport system. Furthermore, it refers to a method for treating a substrate and the use of such transport roller.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

A printed circuit board homogenization treatment device includes a load mechanism, a position mechanism and a drive mechanism. The load mechanism is disk-shaped and configured to fix the printed circuit board; the position mechanism at least includes a first position wheel and a second position wheel that can jointly support the load mechanism; the position mechanism is switchable between a first state and a second state; when the position mechanism is in the first state, the load mechanism and the drive mechanism are spaced apart; when the position mechanism is in the second state, the drive mechanism is configured to drive the load mechanism to rotate around its central axis; both the first position wheel and the second position wheel are configured to rotate with rotation of the load mechanism.

The disclosure relates to a manufacturing line for soldered components on a circuit board, comprising a soldering oven including at least two temperature zones having a predetermined temperature profile, a transport apparatus embodied to transport circuit boards through the temperature zones, and a control system, wherein, in at least one of the temperature zones, at least two heating elements are arranged such that a to-be-soldered surface of each circuit board is heated by the heating elements, wherein, in at least one of the temperature zones, at least two air circulators are arranged in the transport direction offset from one another and facing the surface to be soldered, and wherein the control system is configured to control the heating elements and the air circulators such that the to-be-soldered surface of the circuit board is heated according to the predetermined temperature profile.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

The present invention discloses a carrying device, a wet etching apparatus and a usage method thereof. The carrying device comprises a carrying body and a heating unit both disposed under a to-be-processed substrate, the carrying body is used for carrying the to-be-processed substrate such that the to-be-processed substrate is placed inclined; the heating unit is used for heating the to-be-processed substrate, such that temperature of the to-be-processed substrate rises gradually from a top portion to a bottom portion thereof. In the technical solution of the present invention, by disposing the heating unit under the to-be-processed substrate, the temperature of the to-be-processed substrate rises gradually from the top portion to the bottom portion thereof, thus etch rate of the etchant on the bottom portion of the to-be-processed substrate can be increased, and uniformity of etch rate in the inclined wet etching process is improved.

A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

A method of estimating a virtual contour of an insulating material is disclosed. The method includes the following steps: obtaining a first and a second images at a pair of diagonal locations of the insulating material respectively; determining a first and a second corner locations from the first and the second images respectively; selecting a first set of longitudinal end-point positions and a first set of transverse end-point positions within a range between a first specific distance and a second specific distance from the first corner location; selecting a second set of longitudinal end-point positions and a second set of transverse end-point positions within a range between the first specific distance and the second specific distance from the second corner location; and determining a first transverse axis direction, a first longitudinal axis direction, a second transverse axis direction and a second longitudinal axis direction based on these positions.

A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A method for circuit board assembly is also provided.