The invention relates to a suction-extraction apparatus for extracting a treatment fluid by suction from an essentially planar treatment surface (3a) of treatment substrates (3) transported by means of transporting rollers (8, 10) along an essentially horizontal transporting direction, having a suction source, having a suction-extraction-control unit, which activates the same, and having a suction-extraction-tube unit, which is connected to the suction source and has at least one suction-extraction lance, which can have one or more entry-side suction-extraction-nozzle openings positioned at a suction-extraction distance from the treatment surface. The invention also relates to an etching apparatus equipped with such a suction-extraction apparatus. In the case of a suction-extraction apparatus according to the invention, the suction source and the suction-extraction-control unit are designed for a suction-volume flow per suction-extraction lance of at least 30 m.sup.3/h and a negative suction pressure of no more than 8 kPa. In addition, or as an alternative, the suction-extraction lance has a comb-like suction-extraction structure with a suction-extraction-collecting tube (17) and a plurality of suction-extraction tubes (18) which extend in a comb-like manner from said collecting tube and have the suction-extraction-nozzle openings (19) on the entry side. Use, for example, for etching printed circuit boards, conductor foils or semiconductor wafers.

A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

Apparatus for use with an applicator, systems for dispensing fluids, methods of using a nozzle (52), and a nozzle (52). The nozzle (52) includes a communication device (60) having a memory (86). The memory (86) stores data relating to the operational history and configuration of the nozzle (52). In response to receiving a query signal (90) from an interrogation device (24), the communication device (60) transmits the data residing in the memory (86). The communication device (60) also receives and stores data in the query signal (90) to the memory (86) so that the operational history of the nozzle (52) is maintained in the memory (86) of the communication device (60). The transmitted data may be received by the interrogation device (24) and used to adjust a fluid dispensing operation, determine when the nozzle (52) has reached the end of its operational life, for process improvement, or for inventory tracking.

A chemical engraving machine to engrave a plate of stainless steel moved along an horizontal direction, said machine comprising a base, an acid liquid circuit adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask, a lower guiding device, an upper guiding device, the lower and upper guiding devices being configured to maintain said plate of stainless steel substantially vertically, and a nozzle support bearing a plurality of spraying nozzles projecting horizontally the acid liquid toward the plate of stainless steel. A method chemically engraves a plate of stainless steel in a vertical position.

The objective of the present invention is to provide a precision filter which is suitable for filtering a circuit board production process liquid, which is extremely excellent in the resistance to both a strongly acidic cleaning liquid and a strongly alkaline cleaning liquid and which is extremely excellent in the capability of removing an extremely fine foreign substance. Also, the objective of the present invention is to provide a precision filter cartridge which is used for a circuit board production process liquid and which includes the precision filter. Further, the objective of the present invention is to provide a method for producing a circuit board using the process liquid filtered by the precision filter for a circuit board production process liquid or the precision filter cartridge for a circuit board production process liquid. The precision filter to filtrate a process liquid for producing a circuit board according to the present invention is characterized in comprising a tetrafluoroethylene copolymer (I) having an amino group in a side chain.

A system for dispensing material on a substrate includes a dispensing unit having a dispensing piston. The dispensing piston is pneumatically driven from a first lower position to a second upper position. The system further includes a solenoid valve coupled to the dispensing unit, with the solenoid valve being configured to control air flow to and from the dispensing piston. The solenoid valve includes a solenoid coil and an amplifier connected to the solenoid coil. The system further includes a controller coupled to the amplifier, with the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil.

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.