H05K3/0091

Conductive circuit containing a polymer composition containing thermally exfoliated graphite oxide and method of making the same

A conductive circuit containing a polymer composite, which contains at least one polymer and a modified graphite oxide material, containing thermally exfoliated graphite oxide having a surface area of from about 300 m.sup.2/g to 2600 m.sup.2/g, and a method of making the same.

Method for orienting discrete parts

Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.

Apparatus for the coating of a substrate
09597697 · 2017-03-21 ·

The invention relates to an apparatus for the coating of a substrate, in particular of a circuit board, with a material application device for applying a coating material and with a gas supplying device for the supply of a gaseous medium, the material application device having an inner tubular element, the gas supply device having an outer tubular element which is arranged coaxially to the inner tubular element and surrounds the latter, so as to form between the outer and the inner tubular element a gas supply duct which has an annular orifice at one end, the supply duct being configured so that the gaseous medium flows out, parallel to the coating material, through the annular orifice, in order, when it impinges on the substrate, to displace the applied coating material and thereby distribute it over the area. The apparatus is distinguished in that the material application device has a jet valve which, in a first operating mode, carries out a jetted supply of material into the inner tubular element.

Gas cushion apparatus and techniques for substrate coating

A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.

Circuit board with anti-corrosion properties and electronic device having the same

A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

THERMAL MATERIAL WITHIN A DEVICE
20170055374 · 2017-02-23 ·

In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.

LED-based UV radiation source machine to process coatings
09565771 · 2017-02-07 ·

A machine can include a conveyor that receives and conveys a circuit assembly treated with a UV curable coating material; a UV zone that includes LED-based UV radiation sources; a circuit assembly sensor; a heating zone; and a controller that controls power to at least one of the LED-based UV radiation sources based at least in part on information from the circuit assembly sensor.

PRINTED ELECTRONICS

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

DISPENSE VOLUME ADJUSTMENT BASED ON GAP WIDTH OF LOCATED FEATURES
20250153212 · 2025-05-15 ·

A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.

Hydrophobic low-dielectric-constant film and preparation method therefor

The present disclosure provides a hydrophobic low-dielectric-constant film and a preparation method therefor. The low-dielectric-constant film is formed from one or more fluorine-containing compounds A by means of a plasma enhanced chemical vapor deposition method, and the one or more fluorine-containing compounds comprise a compound having the general formula C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2yn+2 or C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2yn, x being an integer from 1 to 20, y being an integer from 0 to 8, m being an integer from 0 to 6, and n being 0, 3, 6, 7, 9, 10, 12, 13, 15, 16, 17 and 19. Thus, a nano-film having a low dielectric constant and good hydrophobicity is formed on the surface of a substrate.