A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

A processing machine can include motors; at least one heater; first and second processing enclosures separated by a gap; an upper level conveyor that passes circuit assemblies through the first and second processing enclosures and the gap; a lower level conveyor that passes the circuit assemblies through the first and second processing enclosures and the gap; an elevator that transports the circuit assemblies between the upper level conveyor and the lower level conveyor; and a controller that includes circuitry operatively coupled to the motors and to the at least one heater.

A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.

A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

A method comprising: creating, first conductive traces (12) over a substrate (10) by selective creation of metallization over the substrate (10) using selective direct structuring of a material configured for selective direct structuring; and creating second conductive areas (16A, 16B) over the substrate (10) directly in contact with at least darts of the first conductive traces (12).

A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

A method of, and system for, providing an amorphous fluorinated polymer conformal coating to an RF circuit board is described. A coating solution including the amorphous fluorinated polymer dissolved in a fluorinated solvent is provided. The coating solution is applied to the RF circuit board via a mechanically controlled fluid spray application device to produce a coated board. A predetermined time period is waited for substantial evaporation of the fluorinated solvent from the coated board, thus leaving behind a conformal coating of the amorphous fluorinated polymer on a board surface area.

A photocurable composition which decreases a mold releasing force is provided. The photocurable composition is a photocurable composition which is cured using light while being in contact with a mold having a surface in which a concavo-convex pattern is formed so as to manufacture a film having a concavo-convex pattern and which includes a polymerizable compound, a photopolymerization initiator, and a photosensitive gas generating agent having a photostimulation responsive portion. The photosensitive gas generating agent has a repeating structure containing at least one alkylene oxide chain and generates a gas from the photostimulation responsive portion by light irradiation.

Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

A processing machine can include motors; at least one heater; first and second processing enclosures separated by a gap; an upper level conveyor that passes circuit assemblies through the first and second processing enclosures and the gap; a lower level conveyor that passes the circuit assemblies through the first and second processing enclosures and the gap; an elevator that transports the circuit assemblies between the upper level conveyor and the lower level conveyor; and a controller that includes circuitry operatively coupled to the motors and to the at least one heater.