Disclosed herein is a printed circuit board having a structure for preventing coating liquid overflow. In the printed circuit board on which an electronic component is mounted and in which a connection hole for joining the electronic component and another component to each other is formed, a land region to which lead may be applied is formed adjacent to the connection hole.

A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.

A circuit may be configured to reduce electrical signal degradation. The circuit may include a first trace and a second trace that may be broadside coupled between a first ground plane and a second ground plane. The first and second traces may be configured to carry first and second signals, respectively, of a differential signal. The circuit may also include a first dielectric material disposed between the first trace and the second trace. Further, the circuit may include a second dielectric material disposed between the first trace and the first ground plane and disposed between the second trace and the second ground plane. A difference between a first dielectric constant of the first dielectric material and a second dielectric constant of the second dielectric material may suppress a mode conversion of the differential signal from a differential mode to a common mode.

A process is disclosed for coating a substrate. The process includes providing a substrate having at least one free surface; depositing a first layer of a first material on the free surface of the substrate; depositing a second layer of a second material, different from the first material, on the first layer; depositing a third layer of a third material, different from the first and second materials, on the second layer; depositing a protective layer of a fourth material, different from the first, second and third materials, on the third layer; and performing a reflow of at least the second and third layers from the first, second, and third layers, by transfer of heat through the thermal contact on the protective layer, such that the protective layer prevents oxidation of at least the third layer.

A printer includes a belt, a tray and a plurality of printing devices located over the belt. The tray is located on the belt and receives a printed circuit board (PCB). A sensor attached to the tray. The sensor is used to sense whether the PCB is located in the tray, when the PCB is located in the tray, the belt is driven by a driving device to transport the tray to be located below each of the plurality of printing devices. Each of the plurality of printing devices is used to print the PCB. The disclosure further offers a printing method for the PCB using the printer.

A manufacturing process to form a positioning control tool, such as a gyroscope, by using a three-dimensional (3D) printer printing a polymer material mixed with powdered graphene (12a) components (410) on a piezoelectric substrate (205), the components (410) include: a resonator (411) transducer configured to create a first surface acoustic wave (215); a pair of reflectors (412a, 412b) configured to reflect the first surface acoustic wave (215); a structure (413) which, when subjected to a Coriolis force, creates a second surface acoustic wave (230); a first sensor transducer (414) configured to sense the second surface acoustic wave (230); and a second sensor transducer (415) configured to sense a residual surface acoustic wave from a second region of the surface (210) of the piezoelectric substrate free of the structures that respond to the Coriolis force.

A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.