Embodiments herein relate to systems, apparatuses, or processes to using vias, or plated through holes (PTH), within a substrate or within a sub laminate to create capacitors. The interior of a via may have a first layer, or coating, of an electrically conductive material such as copper, formed on the sides of the via. A second layer including a dielectric material is placed on the first layer of the electrically conductive material. A third layer of electrically conductive material may then be placed on the second layer of the dielectric material. Other embodiments may be described and/or claimed.

A printed circuit board (PCB) core structure is provided for the transition of signals from one side of a PCB to an opposing side of the PCB. The PCB core structure may include a laminated core including an inner core including a plurality of conductive layers (N layers), a first dielectric layer, a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core. The PCB core structure may also include a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core. The PCB core structure may also include a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer. The PCB core structure may also include a cavity removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material. The cavity filled with the dielectric material prevents the first conductive trace from shorting to the shielding structure. The PCB core structure may be fabricated by using a single-lamination cycle.

Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V.sub.2/V.sub.1 in the range of 5.0×10.sup.−2 to 1.0×10.sup.2, wherein V.sub.1 (dPa.Math.s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V.sub.2 (dPa.Math.s) is the minimum value of the melt viscosity measured at 60° C. to 100° C. in accordance with JIS-K7244-10:2005, and a pencil hardness of HB or more measured by a pencil hardness test according to JIS-K5600-5-4:1999 in a state of heating at 100° C. for 160 minutes.

A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land and first plane parts, the second conductor layer includes second land and second plane parts, the third conductor layer includes fine wirings and a third plane part, the fourth conductor layer includes fine wirings and a fourth plane part, the substrate includes a through-hole conductor connecting the first and second land parts through the core insulating layer, a first via conductor connecting the first land part and third conductor layer, a second via conductor connecting the second land part and fourth conductor layer, a third via conductor connecting the first and third plane parts, and a fourth via conductor connecting the second and fourth plane parts.

A method for closing a channel-shaped opening with a cross-sectional area and a passage length, more particularly through-bores or plated through-holes in printed circuit boards, using a liquid curable or curing filler material. The opening is closed by a digitally controlled application method with two discharge heads arranged opposite one another, preferably in an inkjet method with two discharge heads designed as print heads and arranged opposite one another. The two discharge heads are controlled such that the opening is filled with the filler material from both sides through the two ends simultaneously. The filler material is discharged by the two discharge heads such that the quantities of discharged filler material meet inside the opening.

A circuit board structure, including a circuit layer, a first dielectric layer, a first graphene layer, a first conductive via, and a first built-up circuit layer, is provided. The circuit layer includes multiple pads. The first dielectric layer is disposed on the circuit layer and has a first opening. The first opening exposes the pads. The first graphene layer is conformally disposed on the first dielectric layer and in the first opening, and has a first conductive seed layer region and a first non-conductive seed layer region. The first conductive via is disposed in the first opening. The first built-up circuit layer is disposed corresponding to the first conductive seed layer region. The first built-up circuit layer exposes the first non-conductive seed layer region and is electrically connected to the pads through the first conductive via and the first conductive seed layer region.

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.