A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.

Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface.

An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of the antenna. An uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a connection via of an uppermost via layer of the plurality of via layers. The connection via penetrates at least a portion of the encapsulant.

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.

There is provided a component mounter that conveys in a board having a product area in which a pattern electrode incorporated in an electrical product is disposed and an inspection area in which an inspection electrode for inspecting electrical characteristics is disposed, and conveys out the board after repeatedly executing an operation of picking up a component supplied by a component feeder and installing the component in the product area according to an installation sequence program, the device including: target event occurrence detector for detecting occurrence of an event that requires inspection of the electrical characteristics with respect to the component supplied by the component feeder; a determiner for determining whether or not the inspection area is vacant; and inspection-required component installer for installing the component picked up from the component feeder in the inspection area as an inspection-required component, in a case where the target event occurrence detector detects the occurrence of the event and the determiner determines that the inspection area is vacant.

The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.