An assembly sheet as a wiring circuit board assembly sheet includes a substrate, a wiring pattern, and a dummy wiring pattern. The substrate includes a product region and a frame region adjacent to the product region. The wiring pattern is located on one side in a thickness direction of the substrate in the product region, and includes a first wiring and a second wiring thicker than the first wiring. The dummy wiring pattern is located on the one side in the thickness direction in the frame region, and includes a first dummy wiring and a second dummy wiring thicker than the first dummy wiring.

The present invention disclosed a radio-frequency identification (RFID) device. The RFID device comprises a protective body and a RFID circuit unit located inside the protective body. The RFID circuit unit comprises a printed circuit board (PCB), a RFID chip and an antenna disposed thereon. A front surface of the PCB faces a top surface of the protective body; a rear surface of the PCB faces a bottom surface of the protective body.

A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.

An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.

An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of the antenna. An uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a connection via of an uppermost via layer of the plurality of via layers. The connection via penetrates at least a portion of the encapsulant.

A manufacturing method of a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. An insulating layer is formed to cover a peripheral region of the stainless steel layer and expose a central region. A circuit structure layer is formed on the central region exposed by the insulating layer. A bottom surface of the circuit structure layer is connected to the first carrier board. A transferring procedure is performed to adhere a top surface of the circuit structure layer onto an adhesive layer of a second carrier board. The first carrier board is separated with the circuit structure layer to transfer the circuit structure layer onto the second carrier board, and expose the bottom surface of the circuit structure layer. The manufacturing method of the circuit board of the present invention is safer and simpler, may effectively reduce the manufacturing costs and improve the product yields.

A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.