A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

The invention relates to a transparent conductive layer comprising non-conductive areas and conductive areas, wherein the conductive areas comprise an FIG. 1 interconnected network of electrically conductive nanoobjects and in the non-conductive areas the nanoobjects are converted into particles and wherein the thickness of the conductive areas and the non-conductive areas differs less than 10 nm. The invention further relates to a process for producing a patterned transparent conductive film, the film comprising a substrate and a transparent conductive layer, and to a process for producing the patterned transparent conductive film.

An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement.

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A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.

A photosensitive conductive paste that contains(a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a pnotopolym.erization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.

A FPC board and a method for manufacturing the same and an OLED display device are provided. The FPC board includes a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer. The thickness of the circuit board terminal is larger than the sum of the thicknesses of the first wire layer and the first protective layer. When the FPC board is connected to the OLED panel, one side of the base substrate on which the panel terminal is provided is opposite to one side of the substrate on which the circuit board terminal is provided, such that the base substrate overlaps with the substrate to connect the circuit board terminal and the panel terminal.

Roll-to-roll processes for manufacturing touch sensors on a plastic base film are provided. The touch sensors can be deposited on the base film using various patterning techniques. One or more shorting bars can also be patterned onto the base film to couple together traces, such as drive lines, sense lines, conductive traces, and the like, of the touch sensor to prevent a potential difference from forming between traces due to static buildup during the manufacturing process. After the touch sensor is fully formed on the base film, the touch sensor can be removed from the base film using lithography or a physical cutting process. The removal process can separate the touch sensor from the one or more shorting bars, thereby uncoupling the traces of the touch sensor.

Roll-to-roll processes for manufacturing touch sensors on a plastic base film are provided. The touch sensors can be deposited on the base film using various patterning techniques. One or more shorting bars can also be patterned onto the base film to couple together traces, such as drive lines, sense lines, conductive traces, and the like, of the touch sensor to prevent a potential difference from forming between traces due to static buildup during the manufacturing process. After the touch sensor is fully formed on the base film, the touch sensor can be removed from the base film using lithography or a physical cutting process. The removal process can separate the touch sensor from the one or more shorting bars, thereby uncoupling the traces of the touch sensor.

A touch panel has an active area and a non-active area disposed at an outer side of the active area defined therein. The touch panel includes a support member and a conductive layer formed on the support member and including an electrode part in the active area to sense touch and a wiring part disposed in the non-active area to be connected to the electrode part. In the non-active area, the wiring part is disposed on the support member and the electrode part is partially disposed on the wiring part.