An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.

A first object of the present invention is to provide a method of manufacturing a conductive substrate having a low defect ratio. In addition, a second object of the present invention is to provide a conductive substrate that is obtained using the method of manufacturing a conductive substrate. In addition, a third object of the present invention is to provide a touch sensor, an antenna, and an electromagnetic wave shielding material that include the conductive substrate.

The method of manufacturing a conductive substrate is a method of manufacturing a conductive substrate including a substrate and a patterned conductive layer that is disposed on the substrate, the method including: a step X1, a step X2, a step X3, a step X4, a step X6, a step X7, and a step X8 in this order, in which in the step X4, a photosensitive resin layer is substantially insoluble in a conductive composition.

A resist layer forming method includes a process of laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature, and a process of pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate having a second temperature lower than the first temperature.

A method for producing a structure, comprising providing a Composite Conductive Substrate (CCS) with a conductive layer, a non-conductive layer and a release layer, implemented on top of the conductive layer; determining an empty conductive pattern for each layer of the structure; printing a layer of non-conductive matter on the CCS, such that the conductive pattern of the first layer left empty from the non-conductive matter; on top of the release layer, below which the conductive layer is implemented, filling the empty conductive pattern with conductive matter by electroplating; peeling the filled conductive matter or peeling the filled conductive matter and the printed non-conductive matter, from the conductive layer of the CCS.

The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μn or greater to smaller than 8.5 μm.

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, in which the binder polymer contains a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, in which the binder polymer contains a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.

A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.