A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A fluidic connection and fluid heating device for a fluid circuit, in particular for a motor vehicle, the device comprising a one-piece tubular body of plastic or composite material comprising at least one internal annular surface defining a fluid flow duct from an inlet to an outlet of the body and at least one external annular surface extending around the duct and on which is located at least one resistive heating element, wherein the resistive heating element is a resistive circuit which is formed in situ on the annular surface.

The invention relates to a medical device comprising a printable electrical component (1), the printable electrical component (1) comprising a plastic substrate (L1) wherein at least electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from the group comprising polycarbonate, cycloolefin copolymers, polymethylacrylate, polypropylene and wherein the dried conductive ink comprise silver and/or gold, wherein the electrical component (E) comprises feather-like and/or meander-like and/or spiral-shaped sections, whereby the medical device further comprises a fluid line, wherein the printable electrical component is located on the outside of the fluid line. The invention also relates to a medical device comprising a printable electrical component (1) the printable electrical component (1) comprising a plastic substrate (L1), wherein at least one electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from a group comprising polycarbonate, cycloolefin copolymers, polymethyl-methacrylate, polypropylene and wherein the dried, conductive ink comprises silver and/or gold, wherein the electrical component (E) comprises at least one conductor section or at least two electrodes, characterized in that the electrical component (E) is part of an expansion sensor and/or a pressure sensor and/or a thermal flow sensor.

An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.

A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.

A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

A flexible resonant trap circuit is provided that includes a transmission line arranged to include a helical winding that has a first helical winding segment and a second helical winding segment; and a capacitor coupled between the first and second helical winding segments.