The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

A system and method for thermally coupling memory devices, such as DIMM memory modules, to an associated memory controller such that both are cooled together at the same relative temperature. By maintaining all of the devices at a much more uniform temperature, memory timing issues are effectively eliminated. In accordance with an exemplary embodiment, the controller chip is physically located between two or more banks of memory, and is positioned under an adjoining heat sink while the memory DIMMs are positioned laterally of the controller chip in angled DIMM slots and are coupled to the controller chip with respective heat spreaders.

A system and method for thermally coupling memory devices, such as DIMM memory modules, to an associated memory controller such that both are cooled together at the same relative temperature. By maintaining all of the devices at a much more uniform temperature, memory timing issues are effectively eliminated. In accordance with an exemplary embodiment, the controller chip is physically located between two or more banks of memory, and is positioned under an adjoining heat sink while the memory DIMMs are positioned laterally of the controller chip in angled DIMM slots and are coupled to the controller chip with respective heat spreaders.

A method of surface mounting micro-devices includes adhering a first plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer, removing the first plurality of micro-devices from donor substrate while the first plurality of micro-devices remain adhered to the transfer surface, positioning the transfer surface relative to a destination substrate so that a subset of the plurality of micro-devices on the transfer surface abut a plurality of receiving positions on the destination substrate, the subset including one or more micro-devices but less than all of micro-devices of the plurality of micro-devices, selectively neutralizing one or more of regions of the adhesive layer on the transfer surface corresponding to the subset of micro-device to light to detach the subset of micro-devices from the adhesive layer, and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate.

Shielded and packaged electronic devices, electronic assemblies, and methods are disclosed herein. The shielded and packaged electronic devices include a packaged electronic device with a package surface and a plurality of electrically conductive package pads arranged on the package surface, a shielding dielectric layer extending in contact with the package surface and having a shielding layer surface and a plurality of openings that extends between the shielding layer surface and the plurality of electrically conductive package pads, and a plurality of electrical conductors that extends from the plurality of electrically conductive package pads and projects from the shielding layer surface. The electronic assemblies include a printed circuit board with a board surface and a plurality of electrically conductive board pads arranged on the board surface, the shielded and packaged electronic device, and an underfill dielectric layer. The methods include methods of manufacturing the electronic assemblies.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical component has a conductive structure on both ends of the electrical component. The electrical component is substantially parallel to the first surface. The method may include forming a laminate layer on the first surface of the base layer, the second surface of the base layer, and between the base layer and the electrical component. The method may include creating a pair of via holes, where the pair of holes align with the conductive structures on both ends of the electrical component. The method may include forming a conductive via in the pair of via holes.

A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.

A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.

A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.