A component carrier includes a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure and a component connected to the stack. The component has a planar redistribution layer at a main surface thereof.

A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.

An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of first grooves and a plurality of second grooves, the first grooves and the second grooves have different sizes, at least one first electronic component of the plurality of first electronic components is disposed in one of the plurality of first grooves, at least one second electronic component of the plurality of second electronic components is disposed in one of the plurality of second grooves, a maximum length passing through a center of a bottom surface of the at least one first electronic component is defined as L1, a bottom length of one side of at least one second groove among the second grooves is defined as L2, and the at least one first electronic component and the at least one second groove satisfy the condition of L1>L2.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.

A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.

An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.