To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced. In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

An electrical box cover for an electrical outlet box includes a back and four sides extending from the back. The back and the four sides define an interior of the box cover that is large enough to cover the exterior of the electrical outlet box. The box cover is made of a soft, flexible material that can be molded to a shape of the electrical outlet box and that has certain elastomeric qualities so that the box cover can be slipped on to the electrical outlet box and installed, thereby providing additional sound and fire protection to the electrical outlet box. The cover box may also include a flange surrounding the opening in the box cover to cover any gaps around the cutout of the wall. The box cover may include one or more knock-outs that correspond to one or more knock-outs in the electrical outlet box.

An electrical box cover for an electrical outlet box includes a back and four sides extending from the back. The back and the four sides define an interior of the box cover that is large enough to cover the exterior of the electrical outlet box. The box cover is made of a soft, flexible material that can be molded to a shape of the electrical outlet box and that has certain elastomeric qualities so that the box cover can be slipped on to the electrical outlet box and installed, thereby providing additional sound and fire protection to the electrical outlet box. The cover box may also include a flange surrounding the opening in the box cover to cover any gaps around the cutout of the wall. The box cover may include one or more knock-outs that correspond to one or more knock-outs in the electrical outlet box.

A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm.sup.3 to 12000 precipitates/μm.sup.3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm.sup.3 to 12000 precipitates/μm.sup.3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.

A bonded substrate includes a substrate, a metal plate forming a stacked state with the substrate, and bonding member. The metal plate has a first surface on the substrate side and a second surface opposite; wherein an edge of the first surface is located outside an edge of the second. The bonding member is disposed between the substrate and plate to bond the plate and substrate, and protrudes from the edge over an entire periphery of the plate. In cut surfaces obtained by cutting the bonded substrate, a peripheral surface length (A) from a portion corresponding to a peripheral edge of the first surface to a corresponding portion of the second, protrusion length of the bonding member, and thickness (C) of the metal plate satisfy first and second expressions.
0.032≤B/(A+B)≤0.400  (First Expression)
0.5(mm)≤C≤2.0(mm)  (Second Expression)