A spectroscopic module includes a support body having a bottom wall portion and a side wall portion surrounding a space on one side of the bottom wall portion, a spectroscopic portion provided on the one side of the bottom wall portion and having a plurality of grating grooves, a photodetector attached to the side wall portion so as to face the spectroscopic portion via the space and having a plurality of photodetection channels, a plurality of first terminals provided on a surface of the support body on a side opposite to the space so as to be disposed along the surface of the support body and electrically connected to the photodetector, and a wiring unit having a plurality of second terminals respectively facing the plurality of first terminals and respectively joined to the plurality of first terminals and a plurality of third terminals respectively and electrically connected to the plurality of second terminals.

A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

A method of making leak tight electrical connections through the wall of a ceramic package, for example a ceramic package used on an image intensifier tube. The method comprises a hole metallisation step (500) to obtain vias, the metallisation step comprising the deposition of a bond layer (510), a diffusion barrier (520) acting as a metallic base layer and a wetting agent (530). For each via, a filler metal preform made of indium or a eutectic chosen from among InSn, AuSn, AuGe, AgSn is deposited (540) on each orifice and is heated to a temperature higher than its melting temperature (550) such that the molten filler metal closes off the via to make it leak tight.

A method for manufacturing a plurality of components, each of the plurality of components including at least one electrical feedthrough, in which a functional element is fastened in a feedthrough opening in a base body by way of an electrically insulating material, an information being acquired in association with each of the plurality of components, the method comprising the steps of: providing, in one of a plurality of manufacturing steps of the method, each of the plurality of components or one of a plurality of pre-stages of each of the plurality of components with an information store, at least one of (i) the information being stored in the information store, and (ii) an identifier is stored in the information store and the information is stored in a database in association with the identifier.

Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

Carrier board structure with an increased core-layer trace area and method for manufacturing the same are introduced. The carrier board structure comprises a core layer structure, a first circuit build-up structure, and a second circuit build-up structure. The core layer structure comprises a core layer, a signal transmission portion, and an embedded circuit layer, wherein the signal transmission portion and the embedded circuit layer are disposed inside the core layer and electrically connected. The first circuit build-up structure is disposed on the core layer on a same side as the embedded circuit layer and is electrically connected to the embedded circuit layer. The second circuit build-up structure is disposed on the core layer on a same side as the signal transmission portion, and is electrically connected to the first circuit build-up structure through the signal transmission portion and the embedded circuit layer.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

A PCB, a method of manufacturing the PCB, and a mobile terminal are provided. The PCB includes a PCB body and a PCB element. A first surface of the PCB body is provided with a groove. The PCB element includes a connection terminal, and a part of the PCB element is arranged within the groove. The connection terminal includes a first portion arranged within the groove and a second groove arranged outside the groove, and the first portion is electrically connected to conductive layers in the PCB body.