A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.sup.2.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

The leadframe substrate includes an isolator incorporated with metal leads by a compound layer. The metal leads are disposed about sidewalls of the isolator and provide horizontal and vertical routing for a semiconductor device to be assembled on the isolator. The compound layer covers the sidewalls of the isolator and fills in spaces between the metal leads, and provides robust mechanical bonds between the metal leads and the isolator.

The leadframe substrate includes an isolator incorporated with metal leads by a compound layer. The metal leads are disposed about sidewalls of the isolator and provide horizontal and vertical routing for a semiconductor device to be assembled on the isolator. The compound layer covers the sidewalls of the isolator and fills in spaces between the metal leads, and provides robust mechanical bonds between the metal leads and the isolator.

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.

The invention is directed to a metal core substrate having high thermal conductivity and high electrical insulating properties; an electrophoretic deposition fluid for use in fabrication of the metal core substrate; and a method for fabricating the metal core substrate. The electrophoretic deposition fluid is used during electrophoretic deposition, and contains ceramic particles for coating a metal substrate, and an organopolysiloxane composition which binds the ceramic particles.

The invention is directed to a metal core substrate having high thermal conductivity and high electrical insulating properties; an electrophoretic deposition fluid for use in fabrication of the metal core substrate; and a method for fabricating the metal core substrate. The electrophoretic deposition fluid is used during electrophoretic deposition, and contains ceramic particles for coating a metal substrate, and an organopolysiloxane composition which binds the ceramic particles.