The β-eucryptite fine particle production method of the invention includes spraying, into an atmosphere at 50° C. to a temperature lower than 300° C., a solution containing a water-soluble lithium salt, a water-soluble aluminum salt, and colloidal silica, in such amounts that the mole proportions among lithium atoms, aluminum atoms, and silicon atoms (Li:Al:Si) are adjusted to 1:1:1, to thereby dry the solution, and, subsequently, firing the dried product in air at 600 to 1,300° C.

The β-eucryptite fine particle production method of the invention includes spraying, into an atmosphere at 50° C. to a temperature lower than 300° C., a solution containing a water-soluble lithium salt, a water-soluble aluminum salt, and colloidal silica, in such amounts that the mole proportions among lithium atoms, aluminum atoms, and silicon atoms (Li:Al:Si) are adjusted to 1:1:1, to thereby dry the solution, and, subsequently, firing the dried product in air at 600 to 1,300° C.

A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.