H05K5/0091

DEVICES AND ACCESSORIES EMPLOYING A LIVING HINGE
20200137906 · 2020-04-30 ·

A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360 allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together.

ELECTRONIC DEVICE

An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.

Package for housing an electric or electronic component

A package for housing an electric or electronic component is disclosed. The package includes a base and a header that includes a top portion and a support portion. The support portion has a first and a second end that defines a first and a second opening respectively. The top portion is secured to the first end and covers the first opening. The top portion includes a header vent to allow a substance (e.g., air, water, etc.) to flow into or out of an interior of the package. The header is configured to house the component therein. The header can be placed into a circular hole of the circuit board. The base is secured to the second end of the support portion, and is configured to secure the package to the circuit board. The vent can minimize moisture within the package and/or drain liquid from inside of the package.

HEAT DISSIPATION IN AN ELECTRONIC CIRCUIT AND METHOD
20200060035 · 2020-02-20 · ·

An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

THERMOPLASTIC COMPOSITE MATERIALS FOR PORTABLE INFORMATION HANDLING SYSTEM ENCLOSURES

Enclosure parts for portable information handling systems may be made by heat pressing material layers together. The material layers may include outer fiber-reinforced thermoplastic layers and a core thermoplastic layer comprising a plurality of thermoplastic film layers. The core thermoplastic layer may be die cut to create voids that reduce weight of the enclosure part. A finishing layer may be added, along with attachment features.

Sensor

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

Card holder and electronic device

A card holder is used for an electronic device having a housing, and is able to accommodate a data card and be inserted into the housing. The card holder includes a card tray and a card cover. The card tray is configured to accommodate the data card. The card cover is connected to the card tray, is rotatable relative to the card tray, and includes a first end and a second end opposite to each other and a first protrusion extending towards the card tray. When the card holder is in a state of being inserted into the housing and a pushing force is applied to the first end, the card cover is rotatable about the first protrusion such that the first end extends further into the housing and the second end extends out of the housing. An electronic device is also provided.

Power module having at least two power semiconductor arrangements that are contacted on a substrate

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

COMPRESSION STRUCTURES FOR IC PACKAGES

Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

ELECTRICAL ASSEMBLY

An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.