An electronic device according to various embodiments of the present disclosure comprises: a first metal housing formed along an edge of the electronic device; a second metal housing spaced apart from at least a portion of the first metal housing; and an injection structure comprising a non-conductive material and at least a portion of which is disposed between the first housing and the second housing, wherein the injection structure and the second metal housing include a recess part on which an electric component disposed along an inner edge of the electronic device is seated, the second metal housing includes a first part connected to the first metal housing and a second part spaced apart from the first metal housing, the first metal housing includes a protrusion part, and the protrusion part may extend to the first part and be joined to the first part.

An electronic device according to various embodiments of the present disclosure comprises: a first metal housing formed along an edge of the electronic device; a second metal housing spaced apart from at least a portion of the first metal housing; and an injection structure comprising a non-conductive material and at least a portion of which is disposed between the first housing and the second housing, wherein the injection structure and the second metal housing include a recess part on which an electric component disposed along an inner edge of the electronic device is seated, the second metal housing includes a first part connected to the first metal housing and a second part spaced apart from the first metal housing, the first metal housing includes a protrusion part, and the protrusion part may extend to the first part and be joined to the first part.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

A scanner for scanning a dental site comprises a base, a detector mounted to the base, and an optical element to redirect light reflected off of the dental site towards the detector along a detection axis in a first direction. Two or more flexures couple the optical element to the base, wherein the two or more flexures maintain an alignment of the optical element to the detector with changes in temperature.

A method for making a composite piece comprised of a metal part and a glass-fiber-reinforced plastic part, comprising: providing a metal part with a receiving cavity and a flow guiding channel, the flow guiding channel having an inlet communicating with the receiving cavity and an outlet; introducing molten plastic reinforced with glass fibers into the receiving cavity to fill the receiving cavity and the flow guiding channel and overflows from the outlet to form a flash section; curing the molten plastic to obtain a plastic part; removing unwanted portion of the metal part together with a portion of the plastic part to obtain the composite piece, wherein the glass-fiber-reinforced plastic part includes an exposed surface and glass fibers exposed at the exposed surface are substantially parallel to each other. A metal-plastic composite part prepared by the method and an electronic device housing are also disclosed.

A method for making a composite piece comprised of a metal part and a glass-fiber-reinforced plastic part, comprising: providing a metal part with a receiving cavity and a flow guiding channel, the flow guiding channel having an inlet communicating with the receiving cavity and an outlet; introducing molten plastic reinforced with glass fibers into the receiving cavity to fill the receiving cavity and the flow guiding channel and overflows from the outlet to form a flash section; curing the molten plastic to obtain a plastic part; removing unwanted portion of the metal part together with a portion of the plastic part to obtain the composite piece, wherein the glass-fiber-reinforced plastic part includes an exposed surface and glass fibers exposed at the exposed surface are substantially parallel to each other. A metal-plastic composite part prepared by the method and an electronic device housing are also disclosed.

An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

According to various embodiments of the present disclosure, an electronic device may comprise a housing including a front plate and a rear plate and a display. At least one of the front plate or the rear plate may include a plate exposed to an outside. The plate may include a metal member including a first metal and an oxide layer formed on at least one surface of the metal member. The metal member may comprise a first portion including irregularities formed by at least one second metal included in a first solution, the at least one second metal being substituted for the a portion of the metal member, the at least one second metal being removed from the metal member by the first solution and a flat second portion etched by the first solution.

According to various embodiments of the present disclosure, an electronic device may comprise a housing including a front plate and a rear plate and a display. At least one of the front plate or the rear plate may include a plate exposed to an outside. The plate may include a metal member including a first metal and an oxide layer formed on at least one surface of the metal member. The metal member may comprise a first portion including irregularities formed by at least one second metal included in a first solution, the at least one second metal being substituted for the a portion of the metal member, the at least one second metal being removed from the metal member by the first solution and a flat second portion etched by the first solution.

This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.