Patent classifications
H05K5/04
BRACKET, BRACKET MANUFACTURING METHOD AND ELECTRONIC DEVICE, INCLUDING THE SAME
An electronic device according to various embodiments of the disclosure may include: a cover glass configured to protect a display; and a bracket, wherein the bracket includes: a first area in contact with the cover glass; and a second area extending from the first area, the first area includes a first surface layer to which a first texture and a first color are applied, the second area includes a second surface layer to which a second texture different from the first texture is applied, the first color is substantially the same color as the cover glass, and the first texture is substantially the same texture as the cover glass.
BRACKET, BRACKET MANUFACTURING METHOD AND ELECTRONIC DEVICE, INCLUDING THE SAME
An electronic device according to various embodiments of the disclosure may include: a cover glass configured to protect a display; and a bracket, wherein the bracket includes: a first area in contact with the cover glass; and a second area extending from the first area, the first area includes a first surface layer to which a first texture and a first color are applied, the second area includes a second surface layer to which a second texture different from the first texture is applied, the first color is substantially the same color as the cover glass, and the first texture is substantially the same texture as the cover glass.
ELECTRONIC CONTROL DEVICE
An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.
ELECTRONIC CONTROL DEVICE
An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.
Coated Metal Alloy Substrate and Process for Production Thereof
A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.
Coated Metal Alloy Substrate and Process for Production Thereof
A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.
Electronic device
An antenna device includes one or more zeroth-order resonant antennas and a metal body. Each of the zeroth-order resonant antennas includes a ground plate configured to provide a ground potential, an opposing conductor arranged at a predetermined distance from the ground plate in a plate thickness direction of the ground plate, a power supply line electrically connected to the opposing conductor, and a short-circuit portion electrically connecting the opposing conductor and the ground plate. The metal body is configured to limit a propagation direction of a radio wave transmitted from or received by the one or more zeroth-order resonant antennas and has an opening.
Electronic device
An antenna device includes one or more zeroth-order resonant antennas and a metal body. Each of the zeroth-order resonant antennas includes a ground plate configured to provide a ground potential, an opposing conductor arranged at a predetermined distance from the ground plate in a plate thickness direction of the ground plate, a power supply line electrically connected to the opposing conductor, and a short-circuit portion electrically connecting the opposing conductor and the ground plate. The metal body is configured to limit a propagation direction of a radio wave transmitted from or received by the one or more zeroth-order resonant antennas and has an opening.
ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS
In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.
ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS
In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.