The present disclosure pertains to an arrangement comprising a housing, a circuit board arranged in the housing and at least one flat contact to connect the circuit board with an electrical component arranged outside of the housing, whereby the housing has a breakthrough that the flat contact protrudes from, whereby the circuit board has breakthrough that the flat contact reaches through, that the circuit board has a contact tab on the side facing away from the housing breakthrough and whereby a molded seal is inserted in the housing breakthrough and the molded seal positively encloses the flat contact and whereby the contact tab is connected with the flat contact in an electrically conductive manner.

A housing for receiving electrical and/or electronic components includes a housing base part and a housing cover which covers the housing base part and which is supported on the housing base part and/or fastened to the housing base part at least by a spacer bolt. The housing cover has an opening. The spacer bolt is integrally or substance bonded to an edge of the opening and the spacer bolt closes the opening. An electronic control unit and a method for producing the housing or the control unit are also provided.

An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.

A thermal control system includes an enclosure configured to contain a thermal mass. A baffle plate is disposed in the enclosure. A heat exchanger is coextensive with and cooperates with the baffle plate to divide the enclosure into a first chamber and a second chamber. An air circulation element cooperates with the baffle plate and the heat exchanger to define an air circulation path and to cause air to flow through the air circulation path. The heat exchanger exchanges thermal energy with the air flowing through the air circulation path.

In various implementations, an enclosure may be utilized to secure component(s) for a variety of applications, such as creating a communications network. For example, an enclosure may be utilized to secure electronic component(s). The enclosure may include shell(s) and a frame coupled to create a seal that inhibits the components in the enclosure from being exposed to fluids and/or particles. The shell(s) or portions thereof may not cause substantial signal loss.

In various implementations, an enclosure may be utilized to secure component(s) to location(s), such as an overhead portion of a structure (e.g., a ceiling) for a variety of applications, such as creating a communications network. For example, an enclosure may be utilized to secure communications component(s). The enclosure may include one or more finishing brackets, back members, mounting brackets, gaskets, and shells. One of more components of the enclosure may be coupled (e.g. via the gasket(s)) to create a seal that inhibits the components in the enclosure from being exposed to fluids and/or particles. The shell may not cause substantial signal loss, in some implementations.

In one aspect, a protective window comprising a first transparent member comprising a polymer; and a protective layer on a first surface of the first transparent member and comprising silsequioxane is provided.

Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

A module includes a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess, a circuit board disposed in the recess; and an encapsulation mass, which closes the recess. A material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients, the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure, and at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure.