An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

An apparatus may be configured to be mounted on a rack. The apparatus may include a communication component. The communication component may be used for communicating with a network device when the network device is mounted on the rack. The apparatus may include a storage device. The storage device may be used for storing information to be provided to the network device, via the communication component, when the network device is mounted on the rack.

A communication system includes an outer housing, an inner housing, and a hanger plate assembly. The outer housing has first and second side walls. The inner housing is at least partially positioned within the outer housing. The inner housing has first and second side walls and is configured to receive a plurality of patch panel devices therein in a stacked arrangement. The hanger plate assembly includes a first hanger plate hingedly coupled to the first side wall of the inner housing and a plurality of hangers connected to the first hanger plate in a stacked arrangement. Each hanger is adapted to support a cable thereon. The hanger plate assembly has a stored condition in which the hanger plate assembly is fully positioned within the outer housing, and a pulled out condition in which the hanger plate assembly is at least partially positioned outside the outer housing.

A system for performing computing operations includes a rack, one or more shelves coupled to the rack, and two or more computing modules. Each computing module may include a chassis, one or more circuit board assemblies in a primarily vertical orientation, and one or more hard disk drives in a primarily vertical orientation. The circuit board assemblies and the hard disk drives are coupled to the chassis of the computing module.

A spring lock includes a sinusoidal spring that has one or more crests and troughs formed along a length of the sinusoidal spring, the length extending along a sliding axis, the one or more crests and troughs forming a sinusoidal spring profile. The spring lock further includes a lock bar that has a track extending along the sliding axis, the track being configured to hold the sinusoidal spring and allow the sinusoidal spring to move along the sliding axis, the track further including one or more depressions and plateaus with the depressions and plateaus forming a lock bar profile, wherein the spring lock is locked when the sinusoidal spring profile and the lock bar profile are out-of-phase and the spring lock is unlocked when the sinusoidal spring profile and the lock bar profile are in-phase.

Systems and techniques for deploying a deployable water barrier to protect server racks and components housed thereon are provided. The deployable water barrier is deployed in response to water detected at the server rack. The deployable water barrier is deployed by a barrier deployment mechanism, causing the barrier to expand and cover a front and/or a back side of the server rack.

The present disclosure provides a power module assembly and a converter. The power module assembly includes a power module and a capacitor module, and the power module and the capacitor module are configured to be detachably connected; the power module includes a first bus bar, and the first bus bar includes a first connection portion and a power installation portion connected to the first connection portion; the capacitor module includes a second bus bar, and the second bus bar includes a second connection portion and a capacitor installation portion connected to the second connection portion, wherein the first connection portion and the second connection portion extend along a first direction, and the power installation portion and the capacitor installation portion extend along a second direction; the first connection portion and the second connection portion are connected by a fastener.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

Internal interchangeable modular avionics platform assemblies and methods for removably mounting and interchanging modular avionics platforms within an aircraft. In some embodiments, modular avionics platform assemblies may include a modular avionics platform configured to support various avionics equipment, suitable for removable mounting within a forward fuselage, and interchangeable with a number of alternate platforms. A platform may include a frame structure, and mounting pins and a connector assembly disposed on the frame structure. The mounting pins may project outwardly from the frame structure to align with and detachably secure to corresponding airframe members of an aircraft when the frame structure is in a mounted position. The connector assembly may be disposed on the frame structure and have a plurality of connectors, including connectors for alternating current, direct current, and data. In some embodiments, the platform may also include an environmental cooling system disposed on the frame structure.