A heat dissipation device (2) for an electronic component is disclosed. The heat dissipation device includes a heat dissipating component (20) disposed on a first side of the electronic component (1); at least one elastic element (30) arranged on a second side of the electronic component (1) opposite the first side; a pressure plate (40) arranged such that the at least one elastic element (30) is located between the pressure plate (40) and the electronic component (1), the pressure plate (40) being connected to a fixed structure to apply pressure to the electronic component (1) via the at least one elastic element (30) in the direction of the heat dissipating component (20). An AC-DC converter or a DC-AC converter or a DC-DC converter comprising the heat dissipation device, and a motor vehicle comprising the above converter are also disclosed.

An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.

A vehicle-mounted inverter skid wherein the bottom plate of a box body (100) is equipped with a plurality of support beams (105), and the height of the support beams (105) is less than the height of a support frame (104), such that the box body (100) is a sunken structure relative to the support frame (104), and the height dimension of the box body (100) is reduced by it being sunken in the direction of the support frame (104); a wire feed-in assembly of a wire feed-in unit (200) comprises a wire feed-in terminal (202) and a wire feed-in bracket (203); the wire feed-in bracket (203) is shaped like the Chinese character for a door, its top plate is provided with an wire feed-in hole (2031), and the wire feed-in terminal (202) is vertically insertedly disposed in the wire feed-in hole (2031) for fixing; the bottom plate of the box body (100) has a wire feed-in port (204) corresponding to the location of the wire feed-in hole (2031), such that the wire feed-in terminal (202) is arranged vertically, reducing the horizontal footprint of the wire feed-in assembly; combined with a magnetic excitation assembly (205) of the wire feed-in unit (200) being separated and arranged in the vacant space on the side of a transformer unit (300), the length and width of the inverter sled are reduced, thus reducing the overall volume of the inverter skid, solving the technical problem of the large size of existing inverter sleds and making it more suitable for vehicle-mounted use.

A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.

A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

According to the present inventive concept, a display device includes a display panel in which a plurality of display modules are horizontally aligned in an M*N matrix, wherein each of the plurality of display modules includes: a mounting surface on which a plurality of inorganic light-emitting elements are mounted; a substrate including a back surface disposed opposite to the mounting surface; and a module heat-dissipation member in contact with the back surface of the substrate to dissipate heat generated in the substrate, wherein the display panel includes a panel heat-dissipation member which connects the respective module heat-dissipation members so as to dissipate heat between the respective module heat-dissipation members of the plurality of display modules.

The disclosure provides a charger, a charging device, an energy supply device and a control method of the charger. The charger comprises a housing, a charging position, a charging port and a first heat dissipation unit. The charger comprises a base and a supporting part. The supporting part is arranged on the base. The charging position is arranged on the base and distributed around the supporting part. The charging port is arranged on the charging position and matched with a battery pack. The first heat dissipation unit is arranged on the supporting part for heat dissipation of the battery pack. With the charger of the disclosure, multiple battery packs can be charged at the same time.

A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.