A power conductor for conducting electricity between a power source and a load is disclosed. A conductive body connects between the power source and the load. A sealed chamber is provided in the interior of the conductive body and contains a working fluid for changing phase when heated. A circuit, a vehicle power distribution circuit, and a vehicle incorporating the same are also disclosed.

A fan frame structure includes a base portion and a wall portion. The base portion has at least one extension section vertically extended from an outer peripheral edge of the base portion, and the extension section has connecting sides. The wall portion is formed along the outer peripheral edge of the base portion through an insert molding process. The wall portion includes a plurality of wall segments connected to the connecting sides of the extension sections, and a clearance is formed between any two adjacent wall segments. With these arrangements, the base portion can better resist a wrapping force from the insert-molded wall portion to avoid deformation.

An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

An outdoor-mountable, telecommunications module, comprising: an environmentally hardened housing; telecommunications equipment encased within the housing and disposed for rotation about an axis within the housing; and a thermal load mitigation system employing (i) a heat spreader structure for thermal conduction of heat away from at least some heat-generating components of the telecommunications equipment, to a rotatable heat sink structure received within the housing, (ii) an arrangement for primarily thermal conduction of heat across a small air gap between the rotatable heatsink structure and a non-rotating heat sink structure collocated within the housing, and (iii) an arrangement for convective heat dissipation into the environment from a radiator structure disposed outside of the housing and which is in direct thermal conductive arrangement with the non-rotating heat sink structure disposed inside of the housing.

A heat dissipation structure assembly includes an elastic limiting member, a paste-type heat dissipation wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The paste-type heat dissipation wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the paste-type heat dissipation wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the paste-type heat dissipation wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the paste-type heat dissipation wall.

A heat-dissipating module including heat-dissipating fins and heat pipes is provided. The heat-dissipating fins include first and second heat-dissipating fins arranged in an interleaved, spaced apart manner, and arranged in parallel along a first direction. The first heat-dissipating fins have interleaved first vias and first breach holes. The second heat-dissipating fins have interleaved second vias and second breach hole. The first breach holes and the second breach holes are arranged along a second direction, and the second vias respectively correspond to the first vias. The first direction is not parallel to the second direction. The heat pipes are configured to pass through the first vias and the second vias. A position of the orthogonal projection of a first breach hole formed on the second heat-dissipating fins along the first direction and the corresponding second breach hole are not overlap or are partially overlapped, and are arranged in symmetry.

This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

High-efficiency cooling is performed in a data center in response to a cooling and/or humidity demand using a system having multiple cooling loops. The system includes a plurality of integrated cooling systems each comprising one or more specifically sized chillers and a liquid loop to address the cooling demand. A free cooling heat exchanger is coupled to the first liquid loop for use when a wet-bulb temperature surrounding the data center is at or below a free cooling set point of the first chilled liquid loop. The system isolates humidity control components to a second chilled liquid loop, and enables greater control of the first chilled liquid loop of the data center to meet specific IT loads.

Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

A VR integrated machine and a running method thereof are provided. The VR integrated machine includes a heat generating device, a heat conducting member and thermoelectric conversion member, the heat conducting member is connected with the heat generating device, the thermoelectric conversion member has a first end connected with the heat conducting member, and is configured to generate electrical energy and to supply the electrical energy to the UR integrated machine.