An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

Systems, apparatus, and methods that control power consumption in a processor are disclosed. One system apparatus, and method includes a processor that operates in at least a first power control mode including a first power amount and a second power control mode including a second power amount lower than the first power amount and a power control device. The power control device is configured to control power consumption in the processor, change a power control mode of the processor to the first power control mode in response to a first excess time period in which the power consumption of the processor exceeds a first reference power for a first period of time, and change the power control mode of the processor to the second power control mode in response to a second period of time in which the power consumption is less than or equal to a second reference power.

A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with one or more heat generating means. The system includes a plurality of first heat exchange circuits and second thermosyphon circuits. The overall configuration of the system being such that the second thermosyphon circuits are in fluid communication with each other according to a parallel connection.

The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.

The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.

A heatsink is used with a fluid flow generator that rotates about a central axis extending vertically. The heatsink includes a main body section having a top surface facing the fluid flow generator in a vertical direction, and fins that extend upward from the top surface so as to define a plurality of flow passages. The plurality of flow passages form a plurality of fluid paths, each of which has an inlet for the fluid discharged from the fluid flow generator to flow in, and an outlet for discharging to outside the fluid that has entered through the inlet. At least one of the plurality of fluid paths has a first branch section for branching from a first fluid path on downstream of the inlet, and a first joining section for joining a second fluid path having another inlet, on downstream of the first branch section.

A cooling structure includes: a main body including a base, and heat dissipation fins and a protrusion that protrude from a heat dissipation surface; a lid member disposed to cover the protrusion and the fins and form a flow path; and a fan mechanism. The fan mechanism includes a vane portion, a driving portion that rotates the vane portion, and a conductive wire for supplying electric power to the driving portion. The protrusion includes a first through hole, and the base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole. The cooling structure enables enhancement of the heat dissipation and shielding performance.

A radiator according to one embodiment of the present invention comprises at least one group of heat dissipation layers that are applied to the surface of the radiator so as to be sequentially layered thereon, wherein the one group of heat dissipation layer comprises a first coating layer formed by applying either a first dispersion solution or a second dispersion solution, and a second coating layer formed by applying the dispersion solution differing from that on the first coating layer, the first dispersion solution comprises positively charged metal oxide nanoparticles, and the second dispersion solution comprises negatively charged carbon nanotubes (CNT-COOH). The heat dissipation layer is formed in a porous thin film structure so as to have thickness of several micrometers, and thus increases a heat dissipation area by ten times, thereby improving heat dissipation efficiency, and can be applied without being restricted by the size, volume, shape, arrangement and the like of a radiator.

A system and a method are disclosed for a cooling bath designed to provide a sufficient and evenly distributed coolant flow throughout the bath. The cooling system includes a holding unit with a coolant distribution chamber that will distribute coolant through multiple distribution pipes beneath device chambers, promoting even distribution of coolant through the device chambers. An external pump causes coolant to be expelled from the cooling bath. The flow of coolant expelled from the cooling bath is controlled in a coolant separation chamber with a separation layer that bisects the coolant separation chamber. The separation layer is perforated with calibrated holes to slow down the speed of coolant exiting the cooling bath to prevent a funnel effect, protect the device chambers from coolant waves and coolant level fluctuation generated by the pump, and evenly distribute removal of hot coolant from the cooling bath.