H05K7/20

Thermal Press-Fit Terminal
20230044199 · 2023-02-09 · ·

A press-fit terminal for connecting a first component and a second component includes a first elastic portion for engaging with the first component, a second elastic portion for engaging with the second component, and an intermediate portion arranged between the first and second elastic portions in an axial direction of the terminal. The intermediate portion comprises a first plurality of radially extending arms for engaging with the first component and a second plurality of radially extending arms for engaging with the second component.

THERMAL TRANSFER SYSTEM AND METHOD
20230045399 · 2023-02-09 ·

Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

RETENTION SYSTEM FOR LIQUID COOLING SYSTEMS OF COMPUTERS
20230044479 · 2023-02-09 · ·

A system for cooling computer hardware includes a heat exchanger having a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side, the second side being opposite to the first side. The system also includes a bracket configured to removably clamp the heat exchangerto the computer hardware.

LIQUID COOLING DEVICE FOR THE ARRANGEMENT OF A POWER SEMICONDUCTOR DEVICE

A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

IMMERSION TANK, INFORMATION PROCESSING APPARATUS, AND METHOD OF COOLING
20230042343 · 2023-02-09 · ·

An immersion tank is used for cooling an electronic circuit. The immersion tank includes a tank body that stores coolant, a housing that is provided inside the tank body and that houses the electronic circuit, a moving member movably supported relative to the tank body, a supply hole which is formed in the housing and through which the coolant is supplied to an inside of the housing, an opening/closing member that is displaced from a closed position at which the opening/closing member closes the supply hole to an open position at which the opening/closing member opens the supply hole, and an operatively associated mechanism that displaces the opening/closing member in accordance with movement of the moving member.

Liquid cooling high-density pluggable modules for a network element

A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

THERMAL TRANSFER SYSTEM AND METHOD
20230043756 · 2023-02-09 ·

Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

THERMAL MANAGEMENT SYSTEM FOR ANTENNA HOUSING
20230039802 · 2023-02-09 ·

An antenna housing configured to house a wireless antenna unit. The antenna housing defines an interior space sized to receive a plurality of wireless radios and/or transceivers. Inlet and outlet ducting extends through the interior of the housing from an inlet manifold to an outlet manifold to individually cool each radio. In an arrangement, the inlet manifold draws air from outside the housing and the outlet manifold exhausts air outside of the manifold.

LIQUID COOLING STRUCTURE WITH LOW-FORCE QUICKSEAL JOINTS FOR CARRYING COOLANT, CABINET, AND SERVER
20230039526 · 2023-02-09 ·

A liquid cooling structure for a server with low-force quickseal joints to carry the coolant includes a first support, a first joint, a second support, a second joint, a first magnet, and a second magnet. The first support is set on the cabinet body. The second support is set on the server body. The first joint is set on the first support. The second joint is arranged on the second support and can be coupled with the first joint. The first magnet is set on first support. The second magnet is set on second support. The first magnet and second magnet with opposite magnetism attract each other to reduce the amount of force required for coupling the first joint and the second joint, and is labor-saving.

RACK MOUNTING ADAPTER WITH AIRFLOW MANAGEMENT

Rack mounting adapters with airflow management are disclosed. In one embodiment, rack mounting adapter apparatus comprises: a housing configured to adapt an electrical component chassis subrack configured for side-to-side airflow cooling to mount to an equipment rack; and an airflow management system within the housing that converts the side-to-side airflow cooling of the electrical component chassis subrack to a front-to-back airflow configuration that intakes air from a front of the equipment rack and exhausts air to a back of the equipment rack.