A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

An airflow device includes a cooling air passage structure formed external to and along a side of a server chassis, the cooling air passage structure extending in a depth direction of the server chassis from a front side of the server chassis. The airflow device further includes an airflow channel formed within the cooling air passage structure, the airflow channel extending in the depth direction, and a vent fluidically connecting the airflow channel with an interior of the server chassis at a vent location that is rearward in the depth direction relative to the front side.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

An electronic device for a motor vehicle, includes a first housing portion to receive one or more first electronic components, a second housing portion to receive one or more second electronic components, the second housing assembled with the first housing, and a coolant fluid inlet and a coolant fluid outlet, a coolant channel being provided in the electronic device for the coolant fluid flowing from the inlet to the outlet so as to cool all or part of the first electronic components and/or all or part of the second electronic components, said channel having, over most of the course thereof in the device, in particular over the whole of the course thereof in the device, a section perpendicular to the flow direction of the fluid which is: exclusively provided in the first housing portion or exclusively provided in the second housing portion.

Systems and methods described herein can provide a thermal interface for an electronic device including: obtaining an enclosure and a circuit within the enclosure, wherein the circuit is disposed within the enclosure such that there is space between the circuit and an internal surface of the enclosure; and positioning a thermally conductive material in the space between the circuit and an internal surface of the enclosure such that the thermally conductive material is in physical contact with an outer surface of the circuit and the internal surface of the enclosure to provide heat transfer from the circuit to the enclosure.

The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

A temperature control system (300) for a variable frequency drive (10, 100) includes a sealed enclosure (310), a power electronic component (330) and/or a power magnetic component (320) positioned inside the sealed enclosure (310), and a controller (400) configured to control a temperature of the power electronic component (330) and/or the power magnetic component (320) relative to an internal air temperature (Tair) inside the sealed enclosure (310) prior to an electrical energy application and operation of the power electronic component (320) and/or power magnetic component (320) to prevent condensation induced electrical failure of the power electronic component (330) and/or power magnetic component (320) utilizing a cooling system (340) and/or a heating system (350).

The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.

A container type variable-frequency drive skid includes a container body, wherein a containing space is provided in the container body, a wiring unit, a voltage transformation unit and a frequency conversion unit are arranged in the containing space, a first cooling unit and a second cooling unit are further arranged in the containing space, the first cooling unit comprises an air duct and a first heat dissipation fan arranged in the air duct, the voltage transformation unit is located in the air duct, air flows through the air duct under the action of the first heat dissipation fan to cool the voltage transformation unit, the second cooling unit comprises a cold guide assembly and a second heat dissipation fan, and the cold guide assembly abuts against the frequency conversion unit. The first cooling unit cools the voltage transformation unit in an air-cooling manner, and the second cooling unit cools the frequency conversion unit in an air cooling and water-cooling combined manner, such that the situation that the voltage transformation unit and the frequency conversion unit cannot operate normally due to too high a temperature is avoided, and the operation efficiency and reliability of the whole machine are improved.