Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).

An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

A thermal conductive device and thermal conductive device manufacturing method, an electrical connector, and an electronic device. The thermal conductive device comprises first housing, a second housing, a capillary mesh component, and a coolant. The second housing is disposed on the first housing. An airtight and vacuumed accommodating space is provided between the first housing and the second housing. The capillary mesh component is disposed in the accommodating space. The capillary mesh component comprises a plurality of capillary pores. The plurality of capillary pores and the accommodating space form a plurality of interconnected circulation channels. The coolant is filled in the accommodating space. Inside the thermal conductive device, the conventional copper powder sintered configuration is replaced with capillary mesh component, so that the thermal conductive device could be thinned and could present a better thermal conductivity.

Provided are an electronic drive device and an electronic steering device, in each of which: a mounting substrate has one surface as a first surface on which a first heat generating component is mounted and the other surface as a second surface on which a second heat generating component is mounted; a first heat dissipation member is arranged in contact with the second surface at a position corresponding to a mounted position of the first heat generating component such that heat generated by the first heat generating component is dissipated to a motor housing; and a second heat dissipation member is arranged in contact with the first surface at a position corresponding to a mounted position of the second heat generating component such that heat generated by the second heat generating component is dissipated to a cover.

A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.

A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

A system and method for cooling electronic equipment having a power supply unit separate from the equipment, sprayers that spray a dielectric liquid coolant on the top of the equipment lengthwise along one or more fins of one or more heat sinks on the equipment, a reservoir, connectors, and pumps for pumping the liquid coolant from the reservoir and through the sprayer, and an external housing.

Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.

A system includes multiple MHACUs for cooling one or more servers in a data hall. The system also includes a pump package for providing cooling fluid to the MHACUs, and a fluid supply line conveying the cooling fluid to the MHACUs. The system also includes at least one computing device configured to: determine that a cooling fluid temperature in a first MHACU has risen to a first temperature that is less than a predetermined maximum temperature; in response to the determination, control the system to provide at least some of the cooling fluid to a second MHACU; determine that the cooling fluid temperature in the second MHACU has risen to a second temperature that is at least the predetermined maximum temperature; and in response to the determination, control the system to provide the cooling fluid to a fluid return line for return to the pump package.