According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer. The circuit substrate comprises: a ground area made of a conductor formed at least one of the first board layer, the second board layer, or the at least one third board layer and electrically connected to the conductive shell through the capacitor while being connected to a ground portion of the electronic device; a first conductive area which is a partial area of the first board layer facing the connector, the first conductive area being made of a conductor having a first size and electrically connected to the conductive shell; and a second conductive area which is an area of the second board layer at least partially facing the first conductive area with the at least one third substrate layer interposed therebetween, the second conductive area being made of a conductor having a second size wider than the first size and electrically connected to the first conductive area. At least one of the first conductive area and the second conductive area may be arranged adjacent to the ground area such that the first conductive area and the second conductive area are electrically separated from the ground area.

A knuckle structure is provided with: a knuckle for rotatably supporting a drive shaft connected to the output shaft of a motor; and a grounding member having a grounding harness, the grounding member electrically connecting the knuckle and a vehicle body. The grounding member is connected to a grounding connection section provided on the protrusion of the knuckle and facing rearward of the vehicle. The grounding connection section is provided between a brake caliper extending in the front-rear direction of the vehicle and the knuckle.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.

A microwave oven includes a frequency converter, a magnetron, a first conductor, and a second conductor. A power supply end of the fre-quency converter is connected to a power supply end of the magnetron by means of the first conductor, and a ground end of the frequency converter is connected to a ground end of the magnetron by means of the second conductor. The first conductor and a part of the second conductor are arranged in parallel, and the distance between the first conductor and the part of the second conductor is less than a preset distance. In this way, RE of the microwave oven can be reduced, and the microwave oven can thus meet the EMC standards.

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Provided are an electrical device and a component for an electrical device that can efficiently suppress the occurrence of a short circuit between a housing and a circuit board. The electrical device includes a housing and a circuit board housed inside the housing. The housing includes a metallic main housing to be attached to an installation section and a sub-housing attached to the main housing. The main housing includes a main wall, extending along the circuit board with a gap between the main wall and the circuit board, and a board attachment portion having the circuit board attached thereto. An insulating plate having insulating properties is fixed to an inner surface of the main wall.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

Provided for may be an electromagnetic interference mitigation apparatus comprising a power supply; a power cord; a power supply chassis encapsulating at least the power supply, the power supply physically isolated from the power cord; a low value resistor in electrical communication with at least the power cord and the power supply; and a capacitor disposed between the power supply chassis and an equipment chassis, wherein the equipment chassis encapsulates the power supply chassis, wherein the equipment chassis is disposed a distance from the power supply chassis, and wherein the capacitor is formed by the equipment chassis and the power supply chassis.

An electromagnetically insulating device includes a body material, an electrically conductive EMI attenuation layer, and a plurality of conductive elements. The body material is substantially planar and flexible. The EMI attenuation layer is positioned inside the body material. The plurality of conductive elements are positioned in the body material. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.