An EMP-resistant (electromagnetic pulse-resistant) case for portable electronic devices is provided. The case includes a conductive external housing configured to enclose the electronic device. The housing includes a lower housing having a continuous connection surface. The housing also includes an upper housing having a continuous connection surface. The lower and upper housing are configured to releasably engage at the continuous connection surface. The housing includes a conductive gasket positioned at the continuous connection surface between the upper and lower housing. The case also includes a first insulative layer at least partially covering the inside surface of the upper and lower housing.

A communication device includes a communication connector, a communication control circuit, and a common mode filter. The communication control circuit controls communication that is established by way of the communication connector. The common mode filter is connected to each of the communication control circuit and the communication connector to relay the communication. Letting a wavelength corresponding to a clock frequency of an electric signal sent out from the communication control circuit be denoted as ?, an electrical length of a signal path at which resonance is produced by a reflected wave resulting from reflection of the electric signal by the common mode filter is closer to an even multiple of ?/2 than to an odd multiple thereof.

A wire harness including: a wire; an electromagnetic wave absorber provided on an outer circumference of a portion of the wire in a length direction of the wire; a protector that has an accommodation configured to accommodate the wire and accommodate the electromagnetic wave absorber; and a first fixing member configured to fix the electromagnetic wave absorber to the protector.

The present invention pertains to a hard disk drive form factor compatible solid-state storage device enclosure assembly that protects circuit boards contained within the enclosure from environmental disruption, such as mechanical stress, vibration, external electronic disruption, or any combination of these, while allowing for a variable number of circuit boards in the SSD enclosure. In another embodiment, the solid-state storage device enclosure assembly, or a similar circuit board assembly, includes an alignment guide that precludes a circuit board from being misaligned within the enclosure.

The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.

A wire harness including: a wire; an electromagnetic wave absorber provided on an outer circumference of a portion of the wire in a length direction of the wire; a protector that has an accommodation configured to accommodate the wire and accommodate the electromagnetic wave absorber; and a first fixing member configured to fix the electromagnetic wave absorber to the protector.

A filter can include a monolithic substrate and at least one conductive layer formed over a top surface of the monolithic substrate and along at least a portion of one or more of a first top edge of the monolithic substrate or a second top edge of the monolithic substrate. A cover layer can be arranged over the top surface of the monolithic substrate. A shield layer can connect with one or more of the conductive layer(s) at the first top edge or the second top edge of the monolithic substrate. The shield layer can include a first portion formed over the first side surface of the cover layer, a second portion formed over the top surface of the cover layer, and a third portion formed over the second side surface of the cover layer.

A radiofrequency filter utilizing a common mode choke both as a traditional common mode choke as well as the inductance in a low pass filter. Filter topology as well as component selection is optimized for wide band operation. Common mode chokes allow differential currents to pass with little attenuation while common mode currents are effectively presented with an inductance in the common current path. This inductance is used in a low pass filter configuration to present an even higher attenuation to common mode currents. The use of multiple chokes and/or differing core materials contributes to wider band operation without pronounced resonances. The capacitance used in the low pass filter is connected in a way as to reduce its effect on the data signals while still being effective in filtering.

An apparatus for absorbing electrical noise on cables that includes a housing which contains two partial shells, each partial shell receiving one element which is composed of a material which decreases or absorbs noise. In a closed state, two end sides of the housing each have one opening for a cable to be routed through. The apparatus further includes at least one fixing means for securing the housing to the cable, with the fixing means being arranged on at least one end side of the housing in the region of the opening, and having at least two clips, the limbs of which face one another and can be deformed transverse to the cable and form a slot for receiving the cable in a clamping manner between them. The limbs of the two clips running parallel to one another.

A filter for electromagnetic noise comprising: a printed circuit board (5) having conductor tracks, having a first side and having a second side opposite the first side; a first busbar (1), which is secured on the first side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks; and a second busbar (2), which is secured on the second side of the printed circuit board (5) and is electrically connected to at least one of the conductor tracks. The printed circuit board (5) is arranged between the first busbar (1) and the second busbar (2) for the insulation thereof.