A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

Provided is a process for producing a graphene oxide platelet-filled polyimide film comprising the steps of: (a) mixing graphene oxide platelets with a polyimide precursor material and a liquid to form a slurry; (b) forming a wet film from said slurry; (c) partially or completely removing the liquid from the wet film to form a precursor polyimide composite film; and (d) imidizing the precursor polyimide composite film to approximately 90% or more completion of the crosslinking reaction, to obtain a graphene oxide platelet-filled composite film.

A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.

A protective housing for shielding an individual against electro-magnetic field (EMF) radiation includes a conductive mesh configured to be suspended from an elevated position, a conductive plane at a base of the protective housing and configured to be a grounding plane for the protective housing, the conductive plane and conductive mesh being configured to shield an interior space, defined by the conductive plane and conductive mesh when suspended, against EMF radiation, and a cable coupled to a circumference of the conductive mesh and configured to weigh down the conductive mesh and to electrically couple the conductive mesh to the conductive plane.

An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.

Electromagnetic interference (EMI) shields are provided to be placed on and cover an electronic component. The EMI shields at least partially surround the electronic component, and include an undulated edge. In some cases, an EMI absorbing material is placed along the undulated edge.

The present invention relates to a steel sheet for shielding a magnetic field, which is used for a medical magnetic resonance imaging (MRI) room wall body and the like, and a method for manufacturing the same.

A module 1a includes a multilayer wiring board 2, a component 3 that is mounted on a main surface 2a of the multilayer wiring board 2, a sealing-resin layer 4 that is laminated on the main surface 2a of the multilayer wiring board 2, and a resin coating layer 7 that coats a surface of the sealing-resin layer 4. The resin coating layer 7 includes a shield film 5 and outer electrodes 6, and opposite surfaces 6a of the outer electrodes 6 and an opposite surface 5a of the shield film 5 are formed on the same plane. The module 1a can be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.

A corona shielding paper for use in a corona shielding system for an electric machine, e.g. a high-voltage machine, may be produced by compacting partial discharge-resistant, planar, conductive particles but can include both reinforcement fibers and a woven fabric.

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.