Embodiments relate to placing one or more light emitting diodes (LEDs) onto a printed circuit board (PCB). Voltage differences are applied to the PCB such that, if properly placed, the one or more LEDs emit light. A camera records the placement and any light emitted from the one or more LEDs. Based upon the images from the camera, a controller can adjust placement parameters of the LEDs until they emit light. Among other advantages, the placement of the LEDs on the PCB can be adjusted in real time and allows insight into the causes of failed LED placement.

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Disclosed is a metal element, such as a structural support or a cover, of a protective casing of a computer for a motor vehicle, which metal element has a first face, which is intended to be oriented toward the exterior of the protective casing, and a second face, which is intended to be oriented toward the interior of the protective casing, the element including a printed circuit board, characterized in that the element includes at least one deformation that protrudes with respect to the first face, the printed circuit board being attached to the second face by way of a self-tapping screw implanted in the deformation.

An electronic device includes a housing having a sidewall defining an internal volume, a display secured to the housing, a camera assembly disposed in the internal volume between the display and the sidewall, a spring finger biasing the camera assembly away from the sidewall, and a compression block disposed between the camera assembly and the sidewall.

A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

An electronic device has a device part 10; and a fiber member 30 for joining the device part 10 to another member other than the device part included in the electronic device.