A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus includes a pair of movable elements that are used in a case where the respective protruding parts of the two lead wires are cut and bent and that are made to approach each other and separate from each other, and a movable element position control section that controls the positions of the pair of movable elements, on the basis of image data obtained by the pair of movable elements being imaged.

A component supply device that images stage on which multiple leaded components are supported in a scattered state, and holds a component supported on the stage using a component holding tool based on the image data, wherein multiple stages of different colors are prepared, and a stage from among the multiple stages a stage with a color different to a component that is planned to be supplied is removably attached to component support member. By this, for example, in a case in which a component planned to be supplied is white, by attaching a black stage to the component support section, due to the contrast between the background and the target object, it is possible to clearly recognize the white component supported on the black stage.

An electrical device includes two or more electrical components that configure an electrical circuit, at least one or more mechanical component that supports the two or more electrical components and is fixed to the two or more electrical components, and a position-adjustment structure that adjusts positions of the two or more electrical components relative to the one or more mechanical component with the at least two or more electrical components being united together, before the one or more mechanical component is fixed to the two or more electrical components.

A display device includes: a display panel including a plurality of pixels that display an image, and a pixel pad portion; a first flexible film electrically connected to the display panel, the first flexible film including a first base film, an output pad portion, and an input pad portion, wherein the first base film includes a surface and an opposite surface facing each other, wherein the output pad portion is disposed on the surface of the first base film and is coupled to the pixel pad portion, and wherein the input pad portion is disposed on the surface of the first base film; a circuit substrate electrically connected to the display panel through the input pad portion, the circuit substrate including a first driving pad portion; and a first substrate disposed on the opposite surface and overlapping either the input pad portion or the output pad portion.

Disclosed is a panel transport tool including a plate member and an adhesive layer provided on the plate member and allowing a transported panel to be attached to and detached from the adhesive layer. The plate member includes a high floor portion holding the transported panel on a surface of the plate member via the adhesive layer, and a low floor portion having a surface below the surface of the high floor portion.

A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

An apparatus for positioning micro-devices on a destination substrate includes a first support to hold a destination substrate, a second support to provide or hold a transfer body having a surface to receive an adhesive layer, a light source to generate a light beam, a mirror configured to adjustably position the light beam on the adhesive layer on the transfer body, and a controller. The controller is configured to cause the light source to generate the light beam and adjust the mirror to position the light beam on the adhesive layer so as to selectively expose one or more portions of the adhesive layer to create one or more neutralized portions. The transfer body and the destination substrate are moved away from each other and one or more micro-devices corresponding to the one or more neutralized portions of the adhesive layer remain on the destination substrate.

A method of surface mounting micro-devices includes adhering a first plurality of micro-devices on a donor substrate to a transfer surface with an adhesive layer, removing the first plurality of micro-devices from donor substrate while the first plurality of micro-devices remain adhered to the transfer surface, positioning the transfer surface relative to a destination substrate so that a subset of the plurality of micro-devices on the transfer surface abut a plurality of receiving positions on the destination substrate, the subset including one or more micro-devices but less than all of micro-devices of the plurality of micro-devices, selectively neutralizing one or more of regions of the adhesive layer on the transfer surface corresponding to the subset of micro-device to light to detach the subset of micro-devices from the adhesive layer, and separating the transfer surface from the destination substrate such that the subset of micro-devices remain on the destination substrate.