An electronic component assembly including a fixing part fixable to a first face on a first-direction side of an adherend, an electronic component, and a housing. The adherend has a housing hole opening in the first face. The housing includes a fixed portion fixed to the fixing part and a housing body to house the electronic component. The housing body includes a first portion disposed on a second-direction side relative to the fixing part. The second direction is opposite to the first direction. The first portion of the housing body has a dimension in the second direction that is equal to, or smaller than, a dimension in the second direction of the housing hole of the adherend. The first portion of the housing body is configured to be housed in the housing hole of the adherend.

A control device is configured as an information processing apparatus which is used for a mounting apparatus for mounting a component on a board. The control device acquires an image, including at least a reference portion in a state where a component is gripped by a component gripper having a positioning grip portion that grips the component in a positioned state, and having the reference portion that represents a reference position serving as a predetermined relative position to the position of the component gripped by the positioning grip portion, acquires a position of the reference portion based on the acquired image, and acquires a position of the component based on the relative position to the acquired position of the reference portion.

Mounting apparatus executes a first mode of, at least when tray member is first moved to a collection position, capturing an image of fiducial marks and obtaining a correction value by which the collection position of component P is corrected based on the positions of fiducial marks in the captured image. Further, mounting apparatus executes a second mode of, when tray member is moved to the collection position, capturing an image of fiducial marks and obtaining a correction value by which the collection position of component P is corrected based on the positions of fiducial marks in the captured image, the correction value being obtained more frequently than in the first mode.

An informing device includes a loading section feeding automatically a subsequent component tape that is preset in the tape feeder when the component tape that is being fed by the feeding device has no component. A controller is configured to determine whether the component tape that is being fed by the feeding device and the subsequent component tape are present in the tape feeder or only one of the component tape and the subsequent component tape is present in the tape feeder based on a management table, and configured to control a display section to inform that the subsequent component tape can be preset in the tape feeder before the subsequent component tape is preset when only one of the component tapes is present in the tape feeder.

A mounting management device sets a production job of production jobs having a largest production parameter to a production job of the production jobs having an Nth largest production parameter as reference jobs of each of N groups, respectively; determines arrangement positions of tape feeders on a pallet so that a production time required for processing each of the reference jobs is as short as possible as determined based upon the arrangement positions of the tape feeders; allocates remaining production jobs excluding the reference jobs of the production jobs to the N groups; and determines arrangement positions of the tape feeders on the pallet based on the remaining production jobs.

A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.

A system and method are directed to a fan board sled assembly comprising a fan circuit board including a first end and an opposing second end, a fan cage module including a front section for receiving and removably securing the first end of the fan circuit board to the fan cage module, and a guide bracket including a base section for receiving and removably securing the second end of the fan circuit board to the guide bracket. The fan cage module further includes a back section for receiving one or more fan bodies. The combined fan circuit board, fan cage module and guide bracket are a single integrated unit insertable and extractable from a chassis opening of a computer chassis.

A component mounter includes a clamp device that includes a board presser plate, a clamper, and a lifting and lowering device configured to move up and down the damper by driving of a motor, the clamp device being configured to sandwich and clamp the board from both sides by moving the damper with the lifting and lowering device and bringing a board conveyed by a conveyance device into contact with the board presser plate. Then, in a clamp control routine, the component mounter sets a target position of the damper according to a thickness of a board such that a contacting surface of the damper moves to a contacted surface of a fixed side clamp member, and drives and controls the motor by position control such that a clamper position coincides with the target position.

A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.