A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

Plug-on ground fault modules are configured with a housing and at least one ground fault terminal. The at least one ground fault terminal can be a rigid or semi-rigid member that is configured to slidably engage a circuit breaker terminal. The modules also include aground fault circuit coupled to the ground fault terminal and at least one printed circuit board in the housing with components of the ground fault circuit including at least one solenoid assembly coupled thereto with a respective magnetized or magnetic plunger member residing on or adjacent thereto, and at least one current transformer. The modules also include at least one collar assembly residing in the housing spaced apart from the solenoid assembly and plunger member that is arranged to be able to engage a lever in the circuit interrupter to delatch the circuit interrupter.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A constitutive device quality determination server is communicably connected to an inspection device via the internet, the inspection device performing an inspection on a constitutive device configuring a board work machine by operating the constitutive device in accordance with to a type of the inspection, and includes an inspection data acquisition section that designates a predetermined type of the inspection for the inspection device and acquires inspection data obtained by the inspection by the inspection device, a determination section that determines quality of the constitutive device based on the acquired inspection data, and a transmission section that transmits a quality determination result determined by the determination section to a terminal device communicably connected over the internet.

An operation checking device of an electronic component mounting machine is provided with a first memory section configured to memorize an operation program of the electronic component mounting machine including at least a collection operation of an electronic component by a collecting device; a second memory section configured to memorize shape data of the electronic component and shape data of the collecting device; a first acquiring section configured to acquire information of the electronic components and information of the collecting device based on the operation program required for a current operation memorized on the first memory section; and a second acquiring section configured to acquire corresponding shape data of the electronic component and shape data of the collecting device from the second memory section based on the information of the electronic component and the information of the collecting device acquired by the first acquiring section.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

A component supply device that images stage on which multiple leaded components are supported in a scattered state, and holds a component supported on the stage using a component holding tool based on the image data, wherein multiple stages of different colors are prepared, and a stage from among the multiple stages a stage with a color different to a component that is planned to be supplied is removably attached to component support member. By this, for example, in a case in which a component planned to be supplied is white, by attaching a black stage to the component support section, due to the contrast between the background and the target object, it is possible to clearly recognize the white component supported on the black stage.

A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle arrives at a position where separating the feeder carriage from the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a release notification indicating that a connection of the feeder carriage is released. The mounting system includes a second processor which causes the connection mechanism to release the connection of the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the release notification upon being informed of completion of the release operation.