Described is an adaptive manufacturing table (100) including a structural frame assembly (300), a moveable table assembly (400) including a table surface (130), and a projector (101) such that the projector (101) is rigidly mounted to the structural frame assembly (300). The projector (101) may be configured to directly project an image onto the table surface (130).

A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

An apparatus for holding a printed circuit board when mounting components thereon, said apparatus comprising a base plate, a mounting device for mounting a printed circuit board spaced from and substantially parallel to the base plate, a plurality of elongate support pins extending through respective holes within the base plate to extend transversely from the base plate, the support pins being independently positionable in height with respect to the base plate to define a configurable support surface for supporting components mounted on the printed circuit board during soldering, wherein the height that each pin extends from the base plate can be adjusted such that the support surface defined by the support pins can correspond to the topography of the circuit board and the components mounted thereon, a locking mechanism being provided for selectively locking the position of each support pin with respect to the base plate, wherein said locking mechanism comprises at least one elongate flexible member arranged to extend around a plurality of said support pins in convolute manner, tensioning device being associated with said at least one flexible member, whereby said tensioning device is adapted to selectively apply tension to said at least one flexible member to grip the pins around which said flexible member extends to lock the position of said pins with respect to the base plate.

A sensor for sensing ions, including a circuit board assembly, a core, a cage at least partially surrounding the core, a first wire wrapped around the core and connected to the circuit board assembly, a second wire wrapped around the core and connected to the circuit board assembly, and a third wire connecting the cage to the circuit board assembly.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

In a case in which mounting deviation is occurring in a component which is mounted onto a solder surface of a board, a pad jig is pushed against the component, and the mounting deviation of the component is corrected through a friction force between the pad jig and the component by causing the pad jig to move in a horizontal direction.

A chuck main body type and claw type deciding table and a pusher type deciding table are memorized in advance, information related to a leaded component such as component size, lead pitch, lead diameter, and component form is acquired, a combination of the chuck main body type and the claw type is searched from the chuck main body type and claw type deciding table using the acquired component size, lead pitch, lead diameter, and the like as search terms, the pusher is searched from the pusher type deciding table using the acquired component form or the like as a search term, and the search results are displayed. By this, it is possible to automatically select a tool made from a combination of multiple configuration members.

An apparatus for manufacturing a display apparatus includes a controller configured to control a second stage, wherein the controller includes an image processor configured to calculate position information of a first material and a second material and alignment information of a bonded material based on image information sensed by a camera unit, an operator configured to calculate final bonding position based on the position information of the first material and the second material calculated by the image processor, a controller unit configured to move the second stage to the final bonding position calculated by the operator, and a deep learning unit configured to update the operator through deep learning based on the alignment information of the bonded material calculated by the image processor.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.