A component mounting line control system controls a component mounting line. The component mounting line includes a component mounting device and a board retrieving unit. The component mounting line control system includes an acquirer and a controller. The acquirer acquires information from the board retrieving unit. The controller controls the component mounting device based on the information acquired by the acquirer. The controller lengthens a time taken for a manufacturing process in the component mounting device in a case where the acquirer acquires first warning information, which indicates that a board accommodation limit is about to be reached, from the board retrieving unit.

A method of removing a magnetic tooling pin from a planar ferromagnetic support surface, comprises providing a pin-placement tool comprising an engagement body and an electrically conductive coil, supplying electrical power to the conductive coil to create a magnetic field which causes the magnetic attraction between the tooling pin and the support surface to be reduced, and moving the engagement body and engaged tooling pin away from the support surface.

A tooling vacuum unit for a circuit board assembly machine, such as a printing machine, which enables two different vacuum sources to be connected to tooling. The tooling vacuum unit may be a retrofittable unit configured to sit on top of a standard tooling table in the machine, or an integrated part of the machine, and provides a tooling support surface for a workpiece being machined. Also described are suction nozzles for securing a printing screen relative to the workpiece.

A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.

A substrate magazine system for loading or unloading devices on production lines has at least one substrate magazine that has two side walls arranged at a distance from, and oriented in parallel to, each other, between which is a plurality of compartments one above the other. The compartments can store one or more flat substrates. Each compartment is formed by two guide rails arranged at a distance from and opposite each other at the side walls. At least one of the side walls is displaceably mounted for changing the clear width between the side walls, and has at least one substrate handling device in, at, or on which the at least one substrate magazine can be arranged. The substrate handling device has a first actuator which can be connected to the displaceably mounted side wall by an actuatable coupling and is designed to displace the displaceable side wall in the connected state.

A configurable belt conveyor for manufacturing comprising first belt and an adaptable border adjacent to the belt. The adaptable border having a first configuration in which a first width of the belt is available for supporting a pallet on the conveyor belt, and a second configuration in which a portion of the belt is covered by the adaptable border, such that the second width of the belt is sized for supporting a printed circuit board (PCB). In one embodiment, the configurable belt conveyor may be configured to form a dual stream conveyor.

A feeder management device and method for managing feeders when producing a board based on a production plan including a board conveyance device; a component supply device in which multiple feeders are detachably mounted at multiple installation positions; and an electronic component mounter including a component transfer device. The method including a current state memory step of linking and storing a current component type of the electronic components, being supplied by the currently mounted feeder, and a position of the mounted feeder; a plan memory step of linking and storing required component types of the electronic components, being mounted on the multiple types of boards, and a position of the feeder of supplying the required components; and a reel removal guide step to remove a first reel from a first feeder of supplying the electronic components of which current state component type does not match the required component types.

A component mounting station is divided into two component mounting areas in a board conveyance direction according to the size of circuit boards used in two types of production that are performed in order, and the area in which a backup pin is arranged on a backup plate is divided into two pin arrangement areas corresponding to the two component mounting areas. The quantity of backup pins necessary to support the component mounting board are arranged in a predetermined arrangement pattern, the circuit boards transported using the conveyor are stopped in the component mounting areas according to the type of component mounting board produced, the backup plate is lifted up, and the circuit boards are clamped by the clamp member, and the circuit boards supported by the backup pins in the pin arrangement areas are positioned below the circuit boards, and components are mounted on the circuit boards.

A contactless electric power supply device configured to widen a range in which power supply is possible to a moving body in a connection direction by supplying electric power from a supply coil to the moving body provided with the receiving coil in a contactless manner and connecting power supply modules provided with the supply coil, wherein, when at least one of the receiving coils is positioned to be able to receiver power from at least one of the supply coils, the contactless electric power supply device performs communication from the power supply module to an alternating module that supplies alternating current and performs communication from the alternating module to the power supply module, and causes a semiconductor switch provided on the power supply module to conduct electricity.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.