A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

An apparatus for storing semiconductor devices includes a reel having a hub and at least two flanges along an axis of the reel. The flanges are spaced and face each other. The semiconductor devices, which typically are attached to a tape, are wound around the hub and between the flanges. At least one holding member is disposed between the flanges at the rim of the apparatus, which is the perimeter of the flanges, and abuts the inner surfaces of the flanges. The holding member prevents the flanges from being deformed during vacuum packing.

A carrier tape includes a longitudinally extending central portion having pockets formed therein. Each pocket respectively comprises a plurality of sidewalls and a bottom. First and second side portions are disposed adjacent to opposite sides of the central portion and extend longitudinally therewith. Each of the first and second side portions includes a respective adhesion zone that is spaced apart from the central portion. Discontinuous raised features disposed between and contacting adjacent pockets. The raised features each respectively extend between the first and second side portions and include a transverse raised platform terminated at opposite ends by first and second longitudinal ribs that are integrally formed with the raised platform. Adjacent pairs of adjacent raised features are separated from one another by first and second collinear transverse channels. A carrier tape assembly included the carrier tape, a cover film, and electronic components disposed in the pockets of the carrier tape.

A tape-and-reel system for processing components is disclosed. In the embodiment, the tape-and-reel system includes a first carrier tape reel for holding unloaded carrier tape, a component loading system for loading components into pockets of the unloaded carrier tape, an air-guided cover tape feeder through which cover tape travels, an alignment tool for guiding the cover tape into alignment with the loaded carrier tape and adhering the cover tape to the loaded carrier tape to secure the components into the loaded carrier tape, and a second carrier tape reel for holding the loaded carrier tape.

Disclosed is an apparatus. The apparatus includes a reel, a carrier tape wrapped about the reel and a cover tape disposed over the carrier tape. The cover tape and the carrier tape are configured to contain a plurality of electronic components, e.g., integrated circuits. At least one of the carrier tape and the cover tape is made of desiccant entrained polymer, or has desiccant entrained polymer provided on it.

A component supply device includes a pallet configured to allow a tray to be arranged thereon, a magazine operable to hold a plurality of pallets, and a magazine holder configured to allow the magazine to be arranged therein. The magazine holder is configured to allow the pallet to be conveyed from the magazine that has been arranged to a component supply position. The component supply device further includes a magazine supply unit configured to supply the magazine to the magazine holder, a magazine ejection unit configured to receive the magazine ejected from the magazine holder, and a magazine conveyance unit configured to convey the magazine from the magazine supply unit to the magazine holder.

A base tape includes an accommodating section having a rectangular or substantially rectangular parallelepiped, and the base tape includes a surface layer including a carbon layer. The accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion. The side wall portion includes at at least one surface thereof an edge portion located between the bottom surface portion and the opening portion and an electrical discharge path portion inclined from the edge portion toward the opening portion. An electronic component array includes the base tape, an electronic component accommodated in the accommodating section of the base tape, and a cover tape that covers the accommodating section.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A system and method for surface mount assembly of PCB's, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.

An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control section drives the movement device to move the member between the first loading surface and the second loading surface when the automatic conveyance apparatus is positioned at a member delivery position and/or a member pickup position where the automatic conveyance apparatus delivers and/or picks up the member and when the height and the inclination of the first loading surface are adjusted in accordance with the height position and the inclination position of the second loading surface by the adjustment device. The automatic conveyance apparatus is configured to travel between multiple predetermined positions including the member delivery position and/or the member pickup position.