An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.

The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.

An electronic component package includes a base tape including recesses. On an inner surface of each of the recesses, a protrusion that can abut an electronic component inside of the recess is provided. The electronic component includes a multilayer body having a parallelepiped or substantially parallelepiped shape and an external electrode on each of two end surfaces of the multilayer body.

An electronic component package includes an electronic component storage container including a main body with recesses to store electronic components positioned along a longitudinal direction of the main body and including openings on one side in a height direction of the main body, a cover sheet to cover the openings of the recesses and removably attached to the main body, and a cover positioned such that the cover sheet is between the cover and the main body, and electronic components stored in the recesses of the electronic component storage container, the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of about 50% or higher.

Provided is an electronic part package body including a carrier tape having a plurality of electronic part housing portions arranged in a longitudinal direction, and a cover tape covering at least the electronic part housing portions by being laminated to the carrier tape. The carrier tape includes a first bonded portion and a second bonded portion that are arranged on outsides of both end portions of the plurality of electronic part housing portions, both end portions being end portions in a width direction of the carrier tape, and are arranged in the longitudinal direction of the carrier tape. One of or both the first bonded portion and the second bonded portion include a reentrant part disposed so as to be continuous from the outside of an electronic part housing portion to a region between electronic part housing portions.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A storage case includes first-side and second-side wall portions, and a storage space to store components therein and being defined by the first-side and second-side wall portions. The storage case includes a component removal opening and a sloped surface inside the storage space and extending towards the component removal opening. One of the first-side and second-side wall portions defines and functions as a radio wave shield.

A case includes a guide portion to guide sliding of a shutter to open and close a discharge port of a case body, a main pathway at which an end of the shutter is located when the shutter is in a state to open the discharge port, and first and second branching pathways into which the end of the shutter can be selectively inserted when the shutter is in a state to close the discharge port. When a pin is fitted into the case body, the end of the shutter is inserted into the first branching pathway, and when the pin is not fitted, the end is inserted into the second branching pathway, so that it is apparent from the exterior that the distal end is inserted into the first or second branching pathway.

A case to be set to a feeder to supply electronic components to a supply target includes a case body including a storage space to accommodate electronic components, a transport section integrally joined to the case body and including a transport path to transport the electronic components to a supply target, a discharge port through which the electronic components in the transport path are discharged, and a communication port to communicate between the storage space and the transport path to enable the electronic components to move from the storage space to the transport path.

A carrier for reversibly immobilizing one or more objects is disclosed. The carrier comprises a frame having a major axis, a top surface, a bottom surface, and one or more openings through the frame along the major axis. The carrier also comprises a film comprising a thermoplastic elastomer material and having a top surface and a bottom surface. The film is attached to the frame based on thermal bonding of the top surface of the film to the bottom surface of the frame, is under tension along the major axis, and is free to flex at the openings. The top surface of the film comprises one or more exposed top surface portions that are accessible through the openings. The exposed top surface portions exhibit a holding force on stainless steel as per ASTM D1000 that is greater than that of the bottom surface of the film.