There is provided a novel substrate support pin installation jig used when installing a substrate support pin for supporting a circuit substrate. The substrate support pin installation jig (hereinafter, may be simply referred to as a jig) according to the present disclosure includes a main body configured to move relative to a support base, multiple pin accommodating portions provided in the main body, and a positioned portion used for positioning on the support base. The substrate support pin is accommodated and held in at least one of multiple pin accommodating portions in the jig. The jig is placed on the support base in a state where a relative position is specified by the positioned portion. By releasing holding of the substrate support pin, the substrate support pin is installed on the support base, and then the jig is removed.

There is provided a novel substrate support pin installation jig used when installing a substrate support pin for supporting a circuit substrate. The substrate support pin installation jig (hereinafter, may be simply referred to as a jig) according to the present disclosure includes a main body configured to move relative to a support base, multiple pin accommodating portions provided in the main body, and a positioned portion used for positioning on the support base. The substrate support pin is accommodated and held in at least one of multiple pin accommodating portions in the jig. The jig is placed on the support base in a state where a relative position is specified by the positioned portion. By releasing holding of the substrate support pin, the substrate support pin is installed on the support base, and then the jig is removed.

A torque transmitter includes a filter header configured to support a filter component. The torque transmitter also includes a torque-transmitting housing configured to at least partially enclose the filter header. The torque-transmitting housing is configured to receive a torque force from an installation tool, and to transmit the torque force to the filter header.

In an electrical characteristic acquisition apparatus, a condition under which an electrical characteristic of a target object is acquired can be inputted by an operator, and an electrical characteristic of the target object is acquired under the input condition. In a case where a condition is inputted as a condition under which an electrical characteristic of the target object is acquired, an erroneous determination is made due to the different conditions that the target object is not an electrical component which complies with the nominal value, or, in a case where a difference between a value representing an electrical characteristic of the target object and a nominal value of the target object is larger than a permissible tolerance, an erroneous determination is made that the target object is defective. Here, these erroneous determinations are prevented from being made.

A motor includes: a rotating shaft; a motor portion; a circuit board; a case having a circuit housing recess portion for housing the circuit board; and a cover made of a synthetic resin and sealing the opening portion of the circuit housing recess portion. The cover has an outer circumference rib and an inside rib. The outer circumference rib is located on the outer circumferential side from the opening end surface of the circuit housing recess portion and projects from the outer circumferential edge of the cover toward the front surface side of the cover and the rear surface side of the cover. The inside rib is located inside from the opening end surface and projects at least either on the front surface side of the cover or on the rear surface side of the cover.

A component shortage detection device detects a component shortage of a tape feeder installed in a component mounting device. The component shortage detection device includes a sensor, configured to detect the tape, and provided at a position that is a midpoint of a tape transportation path of the tape feeder and upstream of a component extraction position by a component mounting head in a tape transportation direction. The component shortage detection device further includes a residual quantity calculation unit configured to calculate a component residual quantity of the tape during a mounting operation; and a determination unit configured to determine whether a component shortage occurs on a basis of output information from the sensor and the component residual quantity when the head fails in extraction of the component.

A manufacturing apparatus of a semiconductor device includes a stage, a bonding head, a copying mechanism mounted on the bonding head, and a controller executing adjustment processing. In the adjustment processing, the controller causes a facing surface of the bonding head to abut against a reference surface of the stage after setting the copying mechanism to a locked state, then presses the facing surface against the reference surface after switching the copying mechanism to a free state, and after that, switches the copying mechanism to the locked state.

An apparatus for repairing elements, includes: a bonding material transfer stamp transferring a new bonding material to a repair area on a substrate, the repair area having a defective element or a residual bonding material removed therefrom; and an element transfer stamp transferring a new element to the new bonding material, wherein the element transfer stamp comprises a load control portion for elements, the load control portion being bent and deformed upon receiving pressing force such that a zero-stiffness load smaller than a critical damage load of the new element is applied to the new element.

A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.