A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

In a component replenishment management system, a setting unit sets work allowable time of an operator in a work area, a replenishment target identification unit identifies component replenishment target devices which are targets of component replenishment work by the operator, and a work progress determination unit determines a progress state of the component replenishment work. Then, an extraction unit extracts the component replenishment target devices for which the component replenishment work is to be performed before work time in the work area by the operator reaches the work allowable time among the component replenishment target devices whose progress state of the component replenishment work is work not performed.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

An ejector unit for detaching an electronic element from an adhesive carrier has an ejector housing with a supporting deck, a light source disposed therein and an ejector lens. The ejector lens has a protruding face. The ejector lens is disposed and oriented with an optical axis extending between the light source and an opening in the supporting deck, and the protruding face of the lens directed towards the opening. The ejector lens is movable relative to the supporting deck along the optical axis to project the protruding face through the opening against the electronic element for lifting the electronic element.

A stamp tool holding device capable of holding a stamp tool while keeping a stamp surface of the stamp tool clean, a stamp tool positioning device that easily positions a stamp tool with respect to a transport head, a multi-element transfer device for efficiently transferring a transport object element such as an element using a stamp tool, and a method of manufacturing an element array using the same, wherein the stamp tool holding device has an installation stage on which a stamp tool is detachably installed. The installation stage has an installation surface on which a housing recess for accommodating a stamp layer of the stamp tool is formed, and a suction hole capable of detachably adsorbing a part of the stamp tool located around the stamp layer is formed on the installation surface.

A method of mounting components on a PCB includes drawing a component, transporting the component to a starting position, taring the sensor, moving the sensor in Z-axis until the component contacts the board surface, activating the regulator, transmitting from the regulator a signal to a industrial robot as Z-axis offset, releasing the components from the industrial robot if the Z-axis offset is greater than or equal to a preset parameter and establishing the current position of the component as a starting point, moving the component if the Z-axis offset is less than the preset parameter beginning from the current position, arresting movement of the component when the sensor detects an opening edge in the board, moving the component away from the opening edge based on data from the sensor, repeating steps while a change in the component movement is executed.

A component feeding system including: a stage configured to support components in a scattered state; a holding tool configured to pick up and hold the component scattered on the stage; an imaging device configured to image the components scattered on the stage; and a control device configured to acquire, based on image data of the imaging device, a pickup possible component quantity that is a quantity of components that can be picked up by the holding tool from among the components scattered on the stage.

A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.

A component supply device includes an introduction sprocket that rotates with an outer peripheral pin engaged with a feed hole of a carrier tape on a conveyance path, thereby conveying the carrier tape, and a wheel that has a plurality of recesses on an outer periphery, and receives the outer peripheral pin of the rotating introduction sprocket by the recess to rotate in accordance with rotation of the introduction sprocket. A contact surface of the outer peripheral pin contacting an inner surface of the recess and a contacted surface with which the outer peripheral pin contacts out of the inner surface of the recess are both formed of flat surfaces, and the contact surface and the contacted surface come into line contact with each other.

Provided is a method for populating printed circuit boards, which includes the steps of acquiring jobs, in each case relating to populating printed circuit boards of a printed circuit board type on the pick-and-place line, and associated probabilities by a job is to be executed in each case, assigning printed circuit board types of the jobs to set-up families, determining for each set-up family the characteristic number which comprises the sum of probabilities of those jobs, the printed circuit board types of which are comprised by the set-up family, optimizing the assignment in such a way that the characteristic numbers of different set-up families are as different as possible, providing a set-up from one of the determined set-up families on the pick-and-place line, and populating printed circuit boards on the pick-and place line.