H05K13/04

Component mounting machine

A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

COMPONENT PLACEMENT MACHINE AND ATTACHMENT

A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole.

Component Stability Structure

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

Solder in cavity interconnection technology
09848490 · 2017-12-19 · ·

An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Component mounting apparatus

A component mounting apparatus includes a carriage that holds a part feeder for supplying a component in a state of being attached to a base and attaches the part feeder to the base in a state of being coupled to the base; a mounting head that mounts the component to a substrate after the component is taken out of the part feeder held by the carriage coupled to the base through an opening formed between the base and a cover member formed so as to cover an upward side of the base; and a shutter moved from an opened position in which the opening is opened to a closed position in which the opening is closed when the carriage is separated from the base.

BOARD MANUFACTURING SYSTEM, AUTONOMOUS MOBILE CART, AND BOARD MANUFACTURING METHOD

A board manufacturing system includes an autonomous mobile cart configured to transport an object used in board work devices of a mounting line, a robot arm provided on the autonomous mobile cart and configured to transport the object used in the board work devices to the board work devices, and a controller provided in the autonomous mobile cart and configured or programmed to control driving of the robot arm. The controller is configured or programmed to control the driving of the robot arm such that the robot arm transports the object used in the board work devices into and out of the board work devices within a movable range of a working unit in the board work devices in a plan view.

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

The component mounting device includes a component supply part on which a component supply unit that supplies a component stored in a carrier tape is detachably mounted; a feeder information acquisition part that acquires feeder information including a type of the component supply unit mounted on the component supply part; a component mounting part that mounts the component supplied from the component supply unit onto a substrate; and a unit controller that controls the component supply unit based on the feeder information.

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
20230199945 · 2023-06-22 · ·

The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
20230199945 · 2023-06-22 · ·

The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.

FEEDER MAINTENANCE APPARATUS AND CONTROL METHOD OF FEEDER MAINTENANCE APPARATUS
20170359928 · 2017-12-14 · ·

A feeder maintenance apparatus that acquires feeder information from a feeder which is mounted on a feeder mounting section, and controls a cleaning section to clean a sprocket section of the feeder, a feeding roller, a first gear mechanism, and a second gear mechanism, based on the feeder information. The feeder maintenance apparatus controls lubricant supply sections to supply a lubricant to a driving section of the feeder based on the acquired feeder information.