A board work management device manages a production line having multiple board work machines that produces electronic-component-mounted-boards by the multiple work machines each being set to perform specified work with respect to the board, with each of multiple of the boards being conveyed sequentially to each of the multiple board work machines, and each of the multiple board machines performing their respective work on each of the multiple boards. The device includes: a board work quantity reset switch; a board work quantity counting section that counts each board on which, from among the multiple board work machines, at least one board work machine has performed work, for each of the at least one board work machines; a board work quantity memory section that memorizes the board work quantity of the board work machine counted by the board work quantity counting section; and a board work quantity resetting section that, when the board work quantity reset switch is operated, resets the board work quantity of a specified board work machine among the at least one board work machines memorized by the board work quantity memory section while the multiple board work machines are operating.

A component mounting machine provided with multiple component transfer devices that each have a mourning nozzle, a movable section, and an XY driving mechanism and perform a component mounting operation, and a control device that controls component mounting operation and performs thermal correction processing that reduces influence of thermal deformation accompanying temperature change of at least one of the movable section and the XY driving mechanism, in which the control device has an implementation period determination section that individually determines an implementation period of the thermal correction processing for each of the component transfer devices based on operation circumstances of each component transfer device, and a thermal correction implementation section that simultaneously performs thermal correction processing for the multiple component transfer devices when it is determined that the implementation period of the thermal correction processing is reached for either of the component transfer devices by the implementation period determination section.

An inserting device includes a feeding mechanism, a positioning mechanism, and an assembling mechanism. The feeding mechanism includes a first supporting plate, a second supporting plate, a lifting assembly and a single-axis sliding table. The second supporting plate includes a first place position and an adjacent second place position. The second supporting plate and the first supporting plate can form a receiving space. The lifting assembly lifts trays located on the first place position and the second place position. The single-axis sliding table is received in the receiving space. The single-axis sliding table includes a sliding block. The sliding block receives the tray dropped from the first placing position and further carries the tray away from the first placing position. The positioning mechanism includes a clamping jaw. The clamping jaw clamps a workpiece from the tray and positions the workpiece again. The assembling mechanism assemblies the workpiece on a product.

An inserting device includes a feeding mechanism, a positioning mechanism, and an assembling mechanism. The feeding mechanism includes a first supporting plate, a second supporting plate, a lifting assembly and a single-axis sliding table. The second supporting plate includes a first place position and an adjacent second place position. The second supporting plate and the first supporting plate can form a receiving space. The lifting assembly lifts trays located on the first place position and the second place position. The single-axis sliding table is received in the receiving space. The single-axis sliding table includes a sliding block. The sliding block receives the tray dropped from the first placing position and further carries the tray away from the first placing position. The positioning mechanism includes a clamping jaw. The clamping jaw clamps a workpiece from the tray and positions the workpiece again. The assembling mechanism assemblies the workpiece on a product.

An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface having an exposed bump and a second surface opposite to the first surface and includes a plurality of element regions defined by dividing regions, a bump embedding process of embedding at least a head top part of the bump into the adhesive layer, a mask forming process of forming a mask in the second surface. The method for manufacturing the element chip includes a holding process of arranging the first surface to oppose a holding tape supported on a frame and holding the substrate on the holding tape, a placement process of placing the substrate on a stage provided inside of a plasma processing apparatus through the holding tape, after the mask forming process and the holding process.

A plurality of signal terminals are disposed in parallel and comprise an embedded part embedded and held in a base member of insulating material and a protruding part that protrudes from the base member, the protruding part forms a connecting part that is electrically connected by contacting or solder-connecting to a mating connecting body, the base member comprises a main body holding part that covers the entire circumference of the circumferential surface of the signal terminals and holds the signal terminals, and a semi-exposed holding part that exposes a portion of the circumferential surface of the signal terminals while covering and holding the remaining portion, with the protruding part of the signal terminals protruding from the semi-exposed holding part with regard to the main body holding part.

A component mounting system is provided with a plurality of component mounting apparatuses having recognition means (a substrate recognition camera) for reading out the substrate ID of the substrate, state detection means (a cover door sensor) for detecting that the substrate is in a state of being able to be inserted or removed, and an information acquisition portion that acquires the substrate ID of the substrate transmitted from the upstream component mounting apparatus which have delivered the substrate. Then, a prescribed number of the substrate IDs for the substrates on which components are mounted is read out in a case where it is detected that the substrate is in a state of being able to be inserted or removed.

A component mounting system is provided with a plurality of component mounting apparatuses having recognition means (a substrate recognition camera) for reading out the substrate ID of the substrate, state detection means (a cover door sensor) for detecting that the substrate is in a state of being able to be inserted or removed, and an information acquisition portion that acquires the substrate ID of the substrate transmitted from the upstream component mounting apparatus which have delivered the substrate. Then, a prescribed number of the substrate IDs for the substrates on which components are mounted is read out in a case where it is detected that the substrate is in a state of being able to be inserted or removed.

A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.

An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.