A bulk feeder includes a feeder main body, a track member having a reception region in which multiple components discharged from a component case accommodating the components in a bulk state are received, a supply region to which the components are supplied, and a conveyance path of the components from the reception region to the supply region, a vibration device configured to apply vibration to the track member such that the components on the conveyance path are conveyed, and a conveyance control section configured to execute a feeding operation of conveying the components on the conveyance path in a direction toward the supply region and a returning operation of conveying the components on the conveyance path in a direction toward the reception region.

The technology relates to a memory insertion apparatus for pushing memory modules into corresponding memory sockets on a circuit board. The memory insertion apparatus may include a frame and an actuation assembly coupled to the frame, and one or more cam assemblies each rotatably coupled to the frame and operatively coupled to the actuation assembly. Each cam assembly may include a central shaft extending in a longitudinal direction, and a plurality of cams each having a tip configured to engage one of the memory modules, the tip extending from the central shaft in a respective radial direction perpendicular to the longitudinal direction. A center of each cam may be offset from centers of adjacent ones of the cams by a pitch distance that is about equal to a pitch distance between centers of adjacent ones of the memory sockets.

The technology relates to a memory insertion apparatus for pushing memory modules into corresponding memory sockets on a circuit board. The memory insertion apparatus may include a frame and an actuation assembly coupled to the frame, and one or more cam assemblies each rotatably coupled to the frame and operatively coupled to the actuation assembly. Each cam assembly may include a central shaft extending in a longitudinal direction, and a plurality of cams each having a tip configured to engage one of the memory modules, the tip extending from the central shaft in a respective radial direction perpendicular to the longitudinal direction. A center of each cam may be offset from centers of adjacent ones of the cams by a pitch distance that is about equal to a pitch distance between centers of adjacent ones of the memory sockets.

A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.

A bulk feeder includes a feeder main body, a track member having a reception region in which multiple components discharged from a component case accommodating the components in a bulk state are received, a supply region to which the components are supplied, and a conveyance path of the components from the reception region to the supply region, a vibration device configured to apply vibration to the track member such that the components on the conveyance path are conveyed, and an alignment member configured to guide the multiple components conveyed by the vibration of the track member and align the components with respect to the feeder main body.

A linear head module includes a plurality of linear units each having an output member, and a housing. The linear unit has a mover and a stator. The stator has an output-side bearing holder and a counter-output-side bearing holder. The housing has: a main body portion integrally including an output-side surface portion, a counter-output-side surface portion, and a coupling portion that couples the output-side surface portion and the counter-output-side surface portion; a flange facing the output-side surface portion; and a bracket facing the counter-output-side surface portion.

A component mounting device that performs mounting processing for mounting a component on a board based on a production program, includes: a storage section configured to store information; a setting section configured to set a correction value related to a mounting position of the component included in the production program; a storage control section configured to make the storage section store date and time information on which calibration related to the mounting processing is executed when the calibration is executed, and to make the storage section store the correction value in association with latest date and time information of the calibration when the correction value is set; and a correction section configured to perform a correction related to the mounting position using the correction value corresponding to the latest date and time information of the calibration without using the correction value not corresponding to the latest date and time information.

A component mounting device that performs mounting processing for mounting a component on a board based on a production program, includes: a storage section configured to store information; a setting section configured to set a correction value related to a mounting position of the component included in the production program; a storage control section configured to make the storage section store date and time information on which calibration related to the mounting processing is executed when the calibration is executed, and to make the storage section store the correction value in association with latest date and time information of the calibration when the correction value is set; and a correction section configured to perform a correction related to the mounting position using the correction value corresponding to the latest date and time information of the calibration without using the correction value not corresponding to the latest date and time information.

A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.

A process for batch fabrication of circuit components is disclosed via simultaneously packaging multiple circuit component dice in a matrix. Each die has electrodes on its tops and bottom surfaces to be electrically connected to a corresponding electrical terminal of the circuit component it's packaged in. For each circuit component in the matrix, the process forms preparative electrical terminals on a copper substrate. Component dice are pick-and-placed onto the copper substrate with their bottom electrodes landing on corresponding preparative electrical terminal. Horizontal conductor plates are then placed horizontally on top of the circuit component dice, with bottom surface at one end of each plate landing on the dice's top electrode. An opening is formed at the opposite end and has vertical conductive surfaces. A vertical conductor block is placed into the opening and lands on the preparative electrical terminal, and the opening's vertical conductive surfaces facing the top end side surface of the vertical block. A thermal reflow then simultaneously melts pre-applied soldering material so that each circuit component die and its vertical conductor block are soldered to the copper substrate below and its horizontal conductor plate above.